WMSIC Electronic Components

FS32K144HAT0MLHT

ModelFS32K144HAT0MLHT
PackageLQFP-64(10x10)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP FS32K144HAT0MLHT
Type
NXP
Unit
Electronic Component
Minimum package
800 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
FS32K144HAT0MLHT
Electronic Component
1
Package
LQFP-64(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
3.8g
CPU
32 Bit
CPU
ARM Cortex-M4F
I / O
58
RAM
64KB
Electronic Component
1
EEPROM
4KB
Electronic Component
BM0231133206
Operating Temperature
40℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FS32K144HAT0MLHT 产品概述

一、产品简介

FS32K144HAT0MLHT 是恩智浦(NXP)基于 ARM Cortex‑M4F 内核的 32 位微控制器,最高主频 80MHz,集成 512KB Flash 程序存储、64KB SRAM 以及 4KB EEPROM。器件采用 LQFP‑64(10×10mm)封装,工作电压范围宽(2.7V ~ 5.5V),工作温度覆盖工业及汽车级(-40℃ ~ +125℃),并内置振荡器,适合对计算性能与可靠性有较高要求的嵌入式应用。

二、核心与存储能力

  • CPU:ARM Cortex‑M4F,32 位架构,内置浮点单元(FPU),对数字信号处理和控制算法(如滤波、PID、傅里叶变换)有明显加速效果。
  • 主频:最高 80MHz,可满足大多数实时控制与中等复杂度的应用需求。
  • 存储:512KB Flash 提供充足的程序空间以容纳功能性固件与安全/诊断模块;64KB RAM 适合运行多任务与缓存数据;4KB EEPROM 可用于保存校准参数、配置信息与小量持久数据。

三、引脚与电气特性

  • I/O:共 58 个可用 I/O,适配多路传感器、执行器及通信端口的连接需求。
  • 电源与时钟:工作电压 2.7V 至 5.5V,便于与多种电源拓扑搭配(3.3V/5V 系统)。器件内置振荡器,可简化外部时钟要求;如需更高时钟精度,可配合外部晶振使用。
  • 温度与封装:工业/汽车级温度范围(-40℃ ~ +125℃)和 LQFP‑64 封装,利于散热与 PCB 布局,也是对可靠性要求较高场合的常用选择。

四、适用场景与设计要点

适用场景包括但不限于工业控制、智能传感与采集、便携式仪器、车载电子(非功能安全具体认证需另行确认)、电机与驱动控制等。设计时建议注意:

  • 电源与去耦:在 VDD/VSS 处做好局部去耦,保证模拟与数字地分离,减少噪声影响。
  • 时钟精度:若系统对定时、通信时钟精度要求高,建议外接晶振或时钟源。
  • 存储管理:合理规划 Flash 与 EEPROM 的写入策略,避免频繁擦写热点区域,延长寿命。
  • 软件优化:利用 Cortex‑M4F 的 FPU 与硬件乘法加速数值运算;对内存与堆栈使用做静态分析,确保在极限工况下的稳定运行。
  • 散热与工艺:在高温工作环境下注意 PCB 铜箔与散热路径设计,遵循封装热规范。

FS32K144HAT0MLHT 以其实用的存储配置、浮点运算能力和宽工作条件,为需要中等计算量和高度可靠性的产品提供了稳健基础。具体外设细节与封装引脚分配建议参考官方数据手册和参考设计,以获得最佳系统集成效果。

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