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P3S0200GMX
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP P3S0200GMX
- Type
- NXP
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- P3S0200GMX
- Electronic Component
- 1
- Package
- XQFN-10(1.6x2)
- Electronic Component
- Signal Switch / Codec / Multiplexer
- Electronic Component
- 0.2g
- Electronic Component
- 1
- Electronic Component
- BM0263476671
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 2.3V~3.6V
- Power Supply
- Power Supply
- Static Current(Iq)
- 0.01uA
- (tpd)
- [email protected],50pF
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
P3S0200GMX 产品概述
一、概述
P3S0200GMX 是恩智浦（NXP）推出的一款单元 I3C 总线开关器件，面向多主机/多从机系统中对 I3C/I2C 总线的选择、隔离与共享场景。器件支持单电源供电，工作电压范围 2.3V 至 3.6V，工作温度范围 -40℃ 至 +85℃，并采用紧凑的 XQFN-10 (1.6 mm × 2.0 mm) 封装，适用于空间受限的移动、可穿戴与嵌入式平台。
二、主要特性
- 支持 I3C 总线切换，兼容 I2C 协议使用场景。
- 单电源供电，工作电压：2.3 V ~ 3.6 V。
- 极低传播延迟：tpd = 0.25 ns（在 3.3 V、50 pF 负载时），对总线时序几乎无影响。
- 超低静态电流：Iq ≈ 0.01 μA，适合低功耗待机系统。
- 宽温度范围：-40℃ ~ +85℃，适配民用与工业级典型应用。
- 封装：XQFN-10，带卷带/卷盘（T/R）包装，利于自动贴片生产。
三、典型应用
- 传感器集线器与多路复用：在同一总线上安全切换多个主机或从机。
- 手机、可穿戴与物联网终端：受限空间内实现总线共享与节电隔离。
- 嵌入式控制与工业测控：多主机冗余、故障隔离与热插拔管理。
- 模块化系统与扩展卡：在不同模块之间无缝切换总线访问。
四、设计要点与布局建议
- 供电与去耦：靠近器件放置 0.1 μF ~ 1 μF 去耦电容，减小瞬态干扰。
- 总线走线：SDA/SCL 及开关引线尽量短，减少负载电容以发挥器件低延迟优势。
- 上拉电阻：根据总线速率与负载选择合适上拉值，避免过强上拉影响低功耗特性。
- 热管理与焊接：XQFN 封装建议在焊盘下设置适当的焊盘与通孔（参考厂商封装说明）以利于回流焊与散热。
- ESD 与保护：在存在强电磁/静电环境时，配合 TVS 或滤波网络提高系统鲁棒性。
五、优势总结
P3S0200GMX 将极低的传播延迟与微安级乃至纳安级的静态功耗结合于紧凑封装，特别适合对总线时序敏感且对功耗有严格限制的现代便携与嵌入式系统。其 I3C/I2C 兼容性和 XQFN-10 小尺寸封装，使其成为多传感器、多主控系统中实现可靠总线切换与隔离的优选器件。
如需在具体电路中使用，请参阅恩智浦的数据手册与应用笔记，以获得完整的引脚定义、时序图与 PCB 布局建议。
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