Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PCA9555AHF,128 PCA9555AHF
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP PCA9555AHF, 128
- Type
- NXP
- Minimum package
- 6000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- PCA9555AHF,128
- Electronic Component
- 1
- Package
- HWQFN-24-EP(4x4)
- Electronic Component
- I / O Expander
- Electronic Component
- 0.08g
- Electronic Component
- 1
- I / O
- 16
- Features
- Built-in LEDDriver; positions; and
- Electronic Component
- BM0242331622
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.65V~5.5V
- Interface Type
- I2C；SMBus
- Current(IOL)
- 25mA
- Clock Frequency(fc)
- 400kHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PCA9555AHF,128 产品概述
一、简介
PCA9555AHF,128 是恩智浦（NXP）出品的一款 16 位 I/O 扩展器，通过 I²C / SMBus 接口实现外设引脚的扩展与管理。器件封装为 HWQFN-24-EP（4×4），工作电压范围宽（1.65V～5.5V），支持 I²C 快速模式（最高 400 kHz），适用于对引脚数量或电平控制有严格要求的低功耗嵌入式系统与工业电子产品。
二、主要功能与特点
- 16 个可编程通用 I/O（分为两个 8 位端口），每位可独立配置为输入或推挽/开漏输出模式。
- 支持中断输出（INT，开漏低有效），便于主控器中断驱动事件处理，降低轮询负担。
- 支持 SMBus/I²C，最高时钟频率 fc = 400 kHz。
- 多器件地址选择，最多支持 8 个 PCA9555 同一总线（通过地址引脚 A0–A2）。
- 低静态电流 Iq：典型 1.5 μA，适合电池供电与低功耗系统。
- 强劲输出能力：灌电流 IOL 可达 25 mA，输出电平 VOH 可到 4.1 V（取决于 VDD 与负载），低电平 VOL 约 200 mV，适合驱动指示灯和部分低/中速负载。
- 工作温度范围宽：-40℃～+85℃。
三、寄存器与操作要点
PCA9555 提供标准的寄存器映射（输入寄存器、输出寄存器、极性反转寄存器、配置寄存器），通过 I²C 读写即可控制或查询引脚状态。常见应用流程：
- 上电后配置各位为输入或输出（配置寄存器）。
- 写输出寄存器控制外设电平，读输入寄存器获取按键或外部状态。
- 通过极性反转寄存器可对个别输入极性进行逻辑反转。
- INT 引脚在配置为中断源并出现状态变化时拉低，需外部上拉以实现检测。
四、封装与布局建议
- 封装：HWQFN-24-EP（4×4），底部有散热焊盘（EP）。
- 布局建议：将 EP 焊盘接地并打满焊盘以利散热，四周加充足过孔导通至内层/底层地。SDA/SCL 线附近放置上拉电阻（典型 2.2k–10k，视速率与系统阻抗而定），INT 引脚需上拉至系统逻辑电平。VDD 侧靠近放置去耦电容（0.1 μF 与 1 μF 并联），靠近器件 VDD 引脚。
五、典型应用场景与设计建议
- 键盘/按键矩阵扫描、LED 指示和状态灯驱动、GPIO 不足时的外扩、系统电源序列控制、工业控制与仪表。
- 当驱动较大电流或电感性负载时，建议在输出端加保护二极管或外接驱动器；若与不同电压域相连，请注意 IO 电压限制并采用电平转换方案。
- 串行总线负载与线长较长时，考虑增加防护与滤波（共模扼流圈、ESD 抑制器等）。
PCA9555AHF,128 因其低功耗、可编程性与良好驱动能力，适合各种需要扩展数字 I/O 的产品设计。按照上述寄存器配置与板级布局建议，可以在保持可靠性的同时实现灵活的外设控制。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
