WMSIC Electronic Components

TEA2096T/1J TEA2096T

ModelTEA2096T/1J
PackageSOIC-8
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

15 specifications

Core information

Product name
NXP TEA2096T / 1J
Type
NXP
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
TEA2096T/1J
Electronic Component
1
Package
SOIC-8
Electronic Component
Specialized Power Management(PMIC)
Electronic Component
0.187g
Electronic Component
1
Features
Electronic Component
Electronic Component
BM0230945748
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TEA2096T/1J 产品概述

一、概述

TEA2096T/1J 为恩智浦(NXP)面向半桥 AC‑DC 开关电源的控制器芯片,采用 SOIC‑8 封装并以 T/R(卷带)形式供货。器件工作在 1000 kHz 高频开关频率,针对轻载条件下的高效模式进行了优化,适合要求小型化、低待机功耗和高度集成控制逻辑的中低功率开关电源场景。

二、主要特性

  • 半桥拓扑专用控制器,内置驱动与时序管理,简化外部功率器件配合设计。
  • 1000 kHz 固定或锁相工作频率,利于磁性元件与电容体积大幅减小。
  • 轻载高效模式:在小负载或待机条件下自动进入高效率运行,降低待机功耗并满足能效法规。
  • 完备的保护与监测:典型包含过流、过压、欠压与过温检测与关断策略(具体保护项请参见规格书)。
  • SOIC‑8 小封装,利于自动贴装与散热设计,T/R 包装便于量产装配。

三、典型应用

  • 电视机、电源适配器与机顶盒的主开关电源(SMPS)
  • LCD/LED 背光驱动电源与小家电电源模块
  • 工业与通讯设备中的板载中低功率 DC‑DC/AC‑DC 转换器
  • 需要低待机能耗与体积受限的消费电子产品

四、封装与引脚(概要)

芯片采用 SOIC‑8(T/R)封装,典型引脚功能包含电源与地、半桥高低端驱动输出、参考/反馈输入、使能/启动以及保护/监测引脚。由于不同版本的引脚命名与功能可能存在差异,建议在设计前严格参照官方数据手册以确认引脚定义与最大额定值。

五、设计与 PCB 布局建议

  • 高频工作要求严格的走线与布局:驱动回路(HO/LO 与功率 MOSFET 栅极-源)应尽量短且成环最小化,减少寄生电感导致的震荡与 EMI。
  • 磁性元件与电解/固态电容可相应缩小,但需在负载与效率之间权衡滤波需求与峰值电流承受。
  • 轻载高效模式切换处需关注环路稳定性,适当调整补偿网络与反馈滤波,避免跳频或不稳定行为。
  • 热设计:虽为控制器但驱动输出与保护电路产生热量,须评估散热路径并在必要处留铜与散热开口。

六、可靠性与保护要点

TEA2096T/1J 通常集成多种保护功能以提升系统鲁棒性。设计中应考虑启动顺序、软启动时间、短路与过载恢复策略以及 EMI 滤波与接地隔离,确保在异常工况下器件与整机安全。

七、选型与采购提示

在选型时需确认目标系统的功率等级、输入电压范围、MOSFET 驱动能力与封装散热能力是否匹配。批量采购可采用 T/R 包装(卷带),有利于贴片产线的平稳供料。最终设计请以芯片官方数据手册与评估板为准,结合实测验证效率、热特性与保护响应。

以上为 TEA2096T/1J 的产品概述与工程使用要点,供方案评估与前期样品开发参考。若需更详细的电气参数、典型外接方案或 PCB 参考布线图,请告知以便提供针对性资料(将依据官方数据表展开)。

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