Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PTN36043ABXY
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP PTN36043ABXY
- Type
- NXP
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- PTN36043ABXY
- Electronic Component
- 1
- Package
- X2-QFN-18-EP(2x2.4)
- Electronic Component
- Analog Switch / Multiplexer
- Electronic Component
- 0.001g
- Electronic Component
- 1
- Channel Count
- 2
- Features
- Analog
- Electronic Component
- BM0238660719
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.8V
- Switch
- 2:1
- (tpd)
- 500ps
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PTN36043ABXY 产品概述
一、概述
PTN36043ABXY 是恩智浦（NXP）推出的一款高性能 2:1 开关电路集成芯片，适用于 1.8V 单电源系统的信号通路选择。器件支持工业级工作温度范围（-40℃ 至 +85℃），在高速切换场合具有低传播延迟（tpd ≈ 500ps），可满足差分或单端高速信号的路由切换需求。
二、主要特性
- 开关类型：2:1 路由/多路复用开关
- 工作电压：1.8 V（单电源）
- 工作温度：-40℃ ~ +85℃（工业级）
- 传播延迟：约 500 ps（高速响应，适合低延迟系统）
- 封装：X2-QFN-18-EP（2.0 × 2.4 mm，带散热焊盘）
- 品牌：NXP（恩智浦）
三、典型应用
- 移动与便携式设备中的高速信号选择与路由
- 通信设备、串行链路和收发器前端的信号切换
- 多路输入的数字视频/音频切换与路由
- 测试测量系统中的切换矩阵与信号注入
四、封装与实装要点
X2-QFN-18-EP 封装尺寸紧凑，适合空间受限的应用。底部暴露焊盘（EP）用于散热与接地，建议在 PCB 对应位置做充分焊盘和过孔网络以增强散热与接地完整性。器件引脚数量与布局请参见官方封装图纸以保证焊盘尺寸和走线规则。
五、设计与注意事项
- 高速信号走线尽量短且阻抗控制良好，避免长走线带来串扰和反射。
- VCC 端靠近器件放置去耦电容（如 0.1 µF）以抑制瞬态噪声。
- 对敏感或高速输入/输出考虑使用差分对匹配与地平面屏蔽。
- 裸露焊盘建议通过多个过孔与底层地连接以提升散热与回流焊可靠性。
- 在强静电环境下，应采取 ESD 保护措施，并参考器件绝对最大额定值。
六、资料与选型提示
本概述基于器件的关键参数与封装信息。选型与最终电路设计请参阅 NXP 官方数据手册与封装图，获取完整的电气特性曲线、时序图、引脚配置和可靠性规范。如需在特定系统中保证兼容性，建议进行实机测量验证以评估信号完整性与切换性能。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
