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PCF85063BTL/1,118 PCF85063BTL
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP PCF85063BTL / 1, 118
- Type
- NXP
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- PCF85063BTL/1,118
- Electronic Component
- 1
- Package
- 10-DFN（2.6x2.6）
- Electronic Component
- Real-Time Clock (RTC)
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Features
- SRAM / NVRAM;;; Output; Programmable Clock Output
- Electronic Component
- BM0264921523
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 900mV~5.5V
- Operating Current
- 220nA
- Interface Type
- SPI
- Crystal Oscillator Type
- Built-in
- Output
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PCF85063BTL/1,118 产品概述
一、产品简介
PCF85063BTL/1,118 是恩智浦（NXP）推出的一款低功耗实时时钟（RTC）芯片。器件集成内部晶振，采用 SPI 接口通信，封装为 10‑DFN（2.6×2.6mm，带裸露焊盘），适用于对尺寸、功耗和可靠性有较高要求的电池供电设备与嵌入式系统。
二、主要功能与特点
- 支持 SPI 接口，便于与 MCU/ASIC 快速连接与数据交换；
- 内置晶振并具备温度补偿，提高长期时钟精度；
- 具备闹钟输出、倒数计时器、周期性中断输出和可编程时钟输出；
- 片内 SRAM/NVRAM 用于保存时间寄存器、配置和少量用户数据；
- 极低功耗：工作电流约 220 nA，静态电流 Iq ≈ 0.22 μA；
- 宽工作电压范围 0.9 V ~ 5.5 V，工作温度 -40 ℃ ~ +85 ℃。
三、电气与时序要点
器件支持在低压（0.9 V）下运行，适合纽扣电池或超级电容备份。SPI 时序与常见主控兼容，提供可编程中断/闹钟以在预定时间唤醒主控或触发外部事件。温度补偿机制有助于减少频漂，保障长期计时精度。
四、封装与布局建议
10‑DFN（2.6×2.6）封装带裸露焊盘，建议在 PCB 布局时：
- 裸露焊盘良好焊接并连接地平面以利散热和机械支撑；
- VCC 旁靠近放置去耦电容，尽量减小电源引线阻抗；
- 虽然晶振为片内结构，但外部敏感信号应远离时钟输出与电源线以避免干扰。
五、典型应用
适合可穿戴设备、智能传感器、物联网终端、数据记录仪、便携医疗设备、工业控制与计量等对低功耗与小型化要求高的应用场景。
六、设计注意事项与建议
- 在电源管理设计中利用闹钟与周期中断减少主控唤醒次数，从而降低系统平均功耗；
- 采用合适的备份电源方案（纽扣电池或超级电容）以保证掉电后时钟运行；
- 在批量设计前阅读完整数据手册，确认寄存器映射、时序限制、电磁兼容及热参数。
如需进一步的器件引脚、寄存器详情或参考电路，请参照 NXP 官方数据手册或提供具体应用环境以便给出针对性的设计建议。
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