Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BFU550AR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP BFU550AR
- Type
- NXP
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- BFU550AR
- Electronic Component
- 1
- Package
- SOT-23(TO-236AB)
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.2g
- Electronic Component
- 1
- Electronic Component
- BM0095651459
- Operating Temperature
- 40℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 11GHz
- Power Dissipation(Pd)
- 450mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BFU550AR 产品概述
一、产品简介
BFU550AR 是由恩智浦（NXP）生产的一款高性能 NPN 型晶体管，专为满足现代电子设备需求而设计。具有优秀的电气性能和可靠性，BFU550AR 常被应用于无线电通信、信号放大及低噪声放大等领域。其紧凑的 TO-236AB（SOT-23）封装使其特别适合空间有限的设计应用。
二、关键规格
电气特性:
- 工作电压: BFU550AR 的集射极击穿电压达12V，支持广泛的应用场景。
- 最大集电极电流 (Ic): 最高可达50mA，适用于中等功率放大。
- 功率处理能力: 最大功率为450mW，适应多种功率要求的电路。
- 增益 (hFE): 在15mA和8V条件下，BFU550AR 具有最低 60 的 DC 电流增益，确保信号有效放大。
- 增益类型: 具有高达18dB的增益，适合于信号传输和处理。
频率特性:
- 跃迁频率: 可达11GHz，使其能够在高频应用中稳定工作，表现出色。
- 噪声系数: 在900MHz下典型噪声系数为0.6dB，为保持信号质量提供了良好的基础，适合对噪声敏感的应用。
温度特性:
- 工作温度范围: BFU550AR 的工作温度范围为-40°C到150°C (TJ)，使其在苛刻的环境中仍能稳定工作。
三、应用领域
BFU550AR 的设计使其适合用于多个领域，包括但不限于：
- 无线通信: 常见于手机、基站及其他通信设备，负责信号增强和处理，确保良好的信号质量。
- 电视及广播设备: 作为信号放大器，提升接收灵敏度，提高观看和收听体验。
- 工业控制系统: 在数据采集和信号处理系统中，BFU550AR 可用于实时监控和控制信号的精确传输。
- 医疗设备: 在医疗成像和监测设备中，BFU550AR 以其低噪声特性，保障信号的完整与准确。
四、优势与特点
- 高性能: BFU550AR 以其低噪声和高增益的优势，在高频工作环境中能够保证信号的质量和稳定性。
- 小尺寸: SOT-23 封装设计，使其适合搭载在小型电路板上，节省空间并提高设计灵活性。
- 广泛应用: 适合多种电子应用，能够满足各种市场需求。
- 环境适应性: 宽广的工作温度范围增强了其在不同环境下的适应性，提高产品的可靠性。
五、结论
BFU550AR 是一款具有高增益、低噪声和良好频率响应的高性能 NPN 小信号晶体管，非常适合用于各种通信和信号处理应用。其突出的技术参数和灵活性使其在现代电子产品中大放异彩，为设计师和工程师提供了理想的解决方案。
选择 BFU550AR，不仅是为了满足当前的设计需求，更是为未来的技术创新打下基础。无论是在高频通信、数据传输还是工业监控领域，BFU550AR 都将始终保持强大的市场竞争力和应用价值。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
