WMSIC Electronic Components

S9KEAZ128AMLK

ModelS9KEAZ128AMLK
PackageLQFP-80(14x14)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP S9KEAZ128AMLK
Type
NXP
Unit
Electronic Component
Minimum package
450 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
S9KEAZ128AMLK
Electronic Component
1
Package
LQFP-80(14x14)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
7.28g
CPU
32 Bit
CPU
ARM Cortex-M0+
I / O
71
RAM
16KB
Electronic Component
1
ADC
12bit
Electronic Component
BM0249867577
Operating Temperature
40℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S9KEAZ128AMLK 产品概述

一、核心性能

S9KEAZ128AMLK 基于 ARM Cortex-M0+ 内核,32 位架构,最高主频 48 MHz,适合对实时性和响应速度有一定要求的嵌入式控制应用。内核能在保持较低功耗的同时提供稳定的运算能力,利于电池供电或低功耗系统设计。

二、存储与 I/O

器件集成 128 KB Flash 程序存储和 16 KB SRAM,可满足中等复杂度的固件与数据缓存需求。片上共有 71 个通用 I/O 引脚,提供了良好的外设扩展能力,适用于多路传感器、驱动和人机交互接口的并行连接。

三、模拟与时钟资源

内置 12-bit ADC,可对多路模拟信号进行较高分辨率采样,适合常规传感器读数与模拟监测。器件采用内置振荡器,简化外部晶振设计,缩短系统启动与调试时间,同时利于成本控制。

四、供电与工作环境

工作电压范围宽,为 2.7V ~ 5.5V,支持常见单电池与多种工业电源方案,电源设计灵活性高。工作温度覆盖 -40℃ 至 +125℃,满足工业级与汽车级温度要求,适合恶劣环境下长期可靠运行。

五、封装与机械特性

本型号以 LQFP-80(14 x 14 mm)封装提供,封装引脚分布便于 PCB 布局与散热处理,适合中等密度电路板设计与批量生产,便于手动或自动贴装和焊接。

六、典型应用与选型建议

结合上述特性,S9KEAZ128AMLK 适合工业控制、楼宇与家电控制器、传感器节点、便携设备及其它对温度与电源适应性有较高要求的嵌入式应用。选型时若侧重更高计算性能或更大内存,应考虑更高主频或更大 Flash/RAM 的系列;若追求最低功耗或更小封装,可比较同系列低功耗型号与不同封装选项。

总体而言,S9KEAZ128AMLK 在性能、接口与工业级耐受性之间提供了均衡的解决方案,是面向中等复杂度嵌入式系统的稳妥选择。若需更详细的引脚功能、电源时序或外设列表,可参考厂商数据手册以作电路和固件设计依据。

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