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LPC1765FBD100K
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- NXP LPC1765FBD100K
- Type
- NXP
- Minimum package
- 450
Technical parameters
- Electronic Component
- NXP
- Electronic Component
- LPC1765FBD100K
- Electronic Component
- 1
- Package
- LQFP-100(14x14)
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 0g
- CPU
- 32 Bit
- CPU
- ARM Cortex-M3
- Electronic Component
- 1
- Electronic Component
- BM0227529006
- CPU
- 100MHz
- Electronic Component
- 450
- Electronic Component
- 256KB
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LPC1765FBD100K 产品概述
一、核心性能与存储
LPC1765FBD100K 基于 ARM Cortex‑M3 内核，最高主频 100MHz，适合对实时性和控制性能有较高要求的嵌入式应用。片上程序存储容量为 256KB Flash，可满足中大型固件与 bootloader 的需求；片上工作 SRAM 常见规格为 32KB（按所给信息），可用于运行时数据与堆栈。Cortex‑M3 架构带来良好的中断响应与低延迟性能，适合运动控制、数据采集与协议处理等场景。
二、封装与引脚资源
器件采用 NXP（恩智浦）LQFP‑100 封装（14x14mm），引脚数多达 100-pin，可提供约 70 个通用 I/O（视具体复用功能而定）。丰富的引脚资源便于外设扩展与多路信号接入，适合需要多通道传感器接口、显示控制和外设并联的系统设计。LQFP 封装兼顾可焊接性与热特性，适合开发板与中小批量产品应用。
三、片上外设与接口能力
LPC1765 系列通常集成多路定时器、PWM 通道、ADC 等模/数混合模块，以及常用串行接口（UART、SPI、I²C），并常见具备 USB 与以太网控制器等通信能力。片内 DMA、外设中断与多种低功耗模式，便于在性能与能耗之间取得平衡。具体外设数量与特性请以器件数据手册为准，但整体定位为“功能全面、适合联网与实时控制”的 32‑bit 微控制器。
四、优势与典型应用
- 性能与成本平衡：100MHz Cortex‑M3 与 256KB Flash 的组合，适合复杂控制与协议栈实现，成本与性能兼顾。
- 引脚与扩展性强：LQFP‑100 与约 70 路 I/O，便于外设并联与 PCB 布局优化。
- 适用场景：工业控制（电机驱动、PLC 扩展板）、通信网关（带以太网/USB 的边缘设备）、数据采集与处理、消费类电子、智能仪表与教学开发平台等。
五、设计注意事项与开发支持
在硬件设计时建议注意电源去耦、芯片供电顺序与 IO 保护；高频时钟与晶振布局应遵循参考设计以保证系统稳定。引脚复用较多时建议提前规划信号分配，避免外设冲突。软件开发可利用 NXP 提供的固件库（LPCOpen）、CMSIS 支持以及主流工具链（Keil, IAR, GCC），便于快速移植与调试。最终产品设计与关键参数应参照 NXP 官方数据手册与应用说明书进行验证与测试。
总结：LPC1765FBD100K 是一款面向需要较强实时性能和丰富接口的嵌入式系统的 100MHz ARM‑M3 MCU，256KB Flash 与大量 IO 提供了良好的功能扩展能力，是工业、通信与复杂控制类项目的合适选择。若需精确外设清单、电气参数或封装引脚图，请参考 NXP 官方资料。
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