WMSIC Electronic Components

LPC11C14FBD48/301 LPC11C14FBD48

ModelLPC11C14FBD48/301
PackageLQFP-48(7x7)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP LPC11C14FBD48 / 301
Type
NXP
Minimum package
250 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
LPC11C14FBD48/301
Electronic Component
1
Package
LQFP-48(7x7)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.652g
CPU
32 Bit
CPU
ARM Cortex-M0
I / O
40
RAM
8KB
Electronic Component
1
Electronic Component
BM0058416923
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~3.6V
CPU
50MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LPC11C14FBD48/301 产品概述

一、引言

LPC11C14FBD48/301 是恩智浦(NXP)公司推出的一款低功耗单片机,属于 LPC1100 系列,该系列主要面向低功耗应用和高性能需求的嵌入式系统。该器件采用 LQFP-48 封装,具备丰富的功能和灵活性,非常适合于各种电子设计中,包括工业自动化、家用电器、智能硬件和物联网设备等。

二、基本规格

  • 类型: 单片机(MCU/MPU/SOC)
  • 系列: LPC1100
  • 型号: LPC11C14FBD48/301
  • 封装: LQFP-48(7x7 mm)
  • 工作电压: 1.8V 至 5.5V
  • 主频: 最大可达 50 MHz
  • 闪存: 32 KB
  • SRAM: 8 KB
  • I/O 引脚: 多达 32 个通用输入输出引脚
  • 外设接口: 包括 I2C、UART、SPI、CAN 等

三、核心特点

  1. 低功耗特性: LPC11C14 采用先进的设计技术,使其在各个工作模式下均能保持低功耗。其适合于电池供电的应用,如可穿戴设备和便携式传感器。

  2. 高性能处理: 该 MCU 支持高达 50 MHz 的处理速度,适合多种需要快速响应和高实时性的应用场景。

  3. 丰富的外设支持: 嵌入式多种外设接口,如 I2C、UART 和 SPI,便于实现与其他设备的通讯和数据交互。这些接口可以灵活配置,提高系统的整体集成度。

  4. 大容量闪存与 SRAM: 配备 32 KB 的闪存和 8 KB 的 SRAM,为用户提供了足够的存储空间以支持复杂的应用程序和数据存储。

  5. 灵活的 I/O 配置: 支持多达 32 个通用 I/O 引脚用户可根据实际需求进行配置,适应不同的应用场景。

  6. 低温漂特性: 适合获得在恶劣环境下的应用表现,电子产品的可靠性大大增强。

四、应用场景

LPC11C14FBD48/301 MCU 的应用范围广泛,主要包括但不限于以下领域:

  • 工业自动化: 可靠的实时控制系统,能够处理多种传感器输入,驱动电机和执行器。
  • 家居自动化: 作为智能家居设备的中枢,控制灯光、温度、安防等功能。
  • 医疗设备: 在可穿戴健康监测设备中,实现精准的数据采集与分析。
  • 物联网设备: 作为物联网传感器节点,收集和传输数据,提高数据的处理与响应速度。

五、开发支持

针对 LPC11C14FBD48/301 这款 MCU,恩智浦公司提供了全方位的开发支持,包括丰富的开发工具、参考设计和详细的技术文档。用户可以使用 LPCXpresso 或 MCUXpresso IDE 等开发环境,加速开发过程。

六、总结

LPC11C14FBD48/301 是一款集成度高、功能丰富且在低功耗设计上具有显著优势的单片机。它的灵活性和稳定性使其适用于多种现代电子产品,特别是在快速发展的物联网和智能家居领域。随着技术的不断进步,LPC11C14FBD48/301 无疑将继续为广大工程师和开发者提供有力支持,推动智能化产品的设计与实现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.