WMSIC Electronic Components

NTB0102GT,115 NTB0102GT

ModelNTB0102GT,115
PackageXSON-8(1x2)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP NTB0102GT, 115
Type
NXP
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
NTB0102GT,115
Electronic Component
1
Package
XSON-8(1x2)
Electronic Component
Converter / Level positions
Electronic Component
0.024g
Electronic Component
1
Electronic Component
1
Features
Output
Electronic Component
BM0257222780
Operating Temperature
40℃~+125℃
Data
100Mbps
Output Type
Electronic Component
Type
Electronic Component
Operating Voltage(VCCA)
1.2V~3.6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NTB0102GT,115 产品概述

一 产品简介

NTB0102GT,115 是恩智浦(NXP)推出的一款双向电压电平转换器,单芯片包含 1 个器件、2 路电路通道,支持高达 100 Mbps 的数据速率。器件两侧供电电压范围宽泛:VCCA = 1.2 V ~ 3.6 V,VCCB = 1.65 V ~ 5.5 V,可在 -40 ℃ 至 +125 ℃ 工业温度范围内可靠工作。器件提供三态输出并具备自动方向检测功能,封装为 XSON-8(尺寸约 1.95 mm × 1.0 mm),适用于空间受限的高密度系统。

二 主要特性

  • 双向(Bi-directional)电平转换,自动方向检测,无需外部方向控制信号;
  • 每芯片 2 通道,单通道支持高达 100 Mbps;
  • VCCA 范围:1.2 V ~ 3.6 V;VCCB 范围:1.65 V ~ 5.5 V,支持多种电源域互连;
  • 输出类型:三态(便于总线共享和热插拔);
  • 工作温度:-40 ℃ ~ +125 ℃(工业级);
  • 小型 XSON-8 封装,便于高密度 PCB 布局。

三 功能与工作原理

NTB0102GT,115 通过内部电路建立两个侧的参考阈值,实现信号沿两侧之间的无缝传输。器件支持自动方向检测:当一侧驱动信号时,器件将该侧驱动的逻辑电平传递至另一侧;若两侧均不驱动,输出处于高阻态以实现总线共享。三态功能允许在需要时将通道断开以避免冲突。宽电压范围使其能在不同电压域(例如 1.2 V 核心域与 3.3 V 或 5 V 外设域)之间直接互通。

四 典型应用场景

  • 多电源嵌入式系统中不同电压域的 GPIO、电平接口互联;
  • 串行通信接口(UART、SPI 等)和低速总线的电平匹配;
  • 需要三态控制或总线隔离的共享总线设计;
  • 工业控制、车载电子、物联网及消费类电子中电源域分割场合。

五 设计与使用注意事项

  • VCCA 与 VCCB 应分别可靠供电,遵循器件电压范围;在电源上电/断电序列时,参考厂商关于 I/O 在欠压状态下行为的建议以避免信号冲突;
  • 若被用于开漏/开集电极总线,应根据数据速率选配合适的上拉电阻;高达 100 Mbps 的信号通常需较小阻值与合理走线以保证边沿完整性;
  • 三态控制和总线冲突:尽管器件支持自动方向检测,仍需在系统层面控制总线驱动源,避免双向同时驱动造成电流冲突;
  • PCB 布局:靠近器件放置去耦电容以保证 VCCA/VCCB 稳定,信号线尽可能短且阻抗连续,关心信号回流路径以降低 EMI/串扰;
  • ESD 与可靠性:器件应按标准进行静电防护处理,遵循厂商推荐的封装焊接与回流曲线。

六 封装与订购信息

  • 封装:XSON-8(1.95 mm × 1.0 mm)适合高密度板级封装与自动贴装工艺;
  • 型号:NTB0102GT,115(请以官方产品目录和最新版数据手册为准获取完整订购与可得性信息)。

七 热管理与可靠性

器件在小型封装中仍能在工业温度范围内工作,但在高功耗或高环境温度场合需关注 PCB 散热路径与周边布局;在长期可靠性设计中,应参考厂商关于热阻、最大结温及焊接工艺的详细说明。

总结:NTB0102GT,115 提供简单、可靠的双向电平转换解决方案,宽电压兼容、自动方向检测和三态输出使其非常适合多电压系统中对信号互通与总线共享的需求。具体参数及参考电路建议以恩智浦官方数据手册为准。

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