WMSIC Electronic Components

LPC804M101JHI33E

ModelLPC804M101JHI33E
PackageHVQFN-32-EP(5x5)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP LPC804M101JHI33E
Type
NXP
Unit
Electronic Component
Minimum package
490 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
LPC804M101JHI33E
Electronic Component
1
Package
HVQFN-32-EP(5x5)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
6.59g
CPU
32 Bit
CPU
ARM Cortex-M0+
I / O
30
RAM
4KB
Electronic Component
1
ADC
12bit
DAC
10bit
Electronic Component
BM0242331626

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LPC804M101JHI33E 产品概述

一、产品简介

LPC804M101JHI33E 是恩智浦(NXP)面向低功耗、成本敏感嵌入式应用的 32-bit 单片机。基于 ARM Cortex‑M0+ 内核,最高主频 15 MHz,集成 32 KB Flash 程序存储与 4 KB SRAM,提供丰富的片上资源和紧凑封装,适合传感采集、小型控制与便携设备等场景。

二、核心参数

  • CPU 内核:ARM Cortex‑M0+,32 bit,最高主频 15 MHz
  • 程序存储:32 KB Flash
  • 工作 RAM:4 KB SRAM
  • I/O 数量:30 个通用 I/O(GPIO)
  • ADC:12 bit(片上模数转换)
  • DAC:10 bit(片上数模转换)
  • 振荡器:内置振荡器(内部时钟源)
  • 工作电压:1.71 V ~ 3.6 V
  • 工作温度范围:-40 ℃ ~ +105 ℃
  • 封装:HVQFN‑32‑EP (5×5 mm)

三、片上外设与能力

LPC804M101JHI33E 在有限资源下兼顾模拟与数字接口能力,12-bit ADC 提供较高分辨率的传感输入能力,10-bit DAC 便于生成模拟参考或控制信号。30 路 GPIO 适合多路开关、LED、按键或外设控制接入。片内集成的内振荡器减少外部晶振需求,简化 BOM 并降低系统成本。

四、封装与电气特性

HVQFN‑32‑EP 5×5 mm 小封装带有散热引脚(EP),利于热管理与 PCB 布局。工作电压覆盖 1.71–3.6 V,支持常见单节锂电或 3.3 V 系统电源。工业级温度等级(-40 到 +105 ℃)满足多数工业与汽车级边缘应用要求。

五、典型应用场景

  • 低功耗传感节点与数据采集设备
  • 工业和楼宇自动化中小型控制器
  • 人机接口控制(按键、背光、简单显示驱动)
  • 电池供电便携设备与测量仪器
  • 简单信号生成与模拟控制环路

六、设计建议与注意事项

  • 电源与旁路:靠近芯片的 VDD 引脚放置适当的去耦电容,保证 ADC 工作时的参考稳定性。EP 焊盘需良好接地以利散热与电气性能。
  • ADC/DAC 设计:为保证 12-bit/10-bit 精度,模拟输入/输出应注意参考电压洁净与抗干扰,必要时使用外部参考或滤波。
  • 时钟选择:内置振荡器可满足多数应用,但对时间精度要求高的场合可考虑外部晶振或 PLL(若芯片支持)方案。
  • 温度与可靠性:在高温环境下进行充分测试,关注 Flash 与 SRAM 的长期可靠性与数据完整性。
  • 调试与编程:基于 Cortex‑M0+,通常通过 SWD 等常见调试接口进行烧写与调试,建议在设计早期预留调试引脚与编程接口。

七、开发支持

LPC804 系列可利用恩智浦提供的软件包与示例代码进行快速开发,常见的开发环境包括厂家 SDK、Keil、IAR 以及社区工具链。配套参考设计、数据手册与评估板可大幅缩短开发周期。

总结:LPC804M101JHI33E 在小型封装内以 Cortex‑M0+ 为核心,提供平衡的存储、I/O 与模拟能力,适合对成本、尺寸与工业温度有要求的嵌入式应用。选择与布局时关注电源完整性与模拟信号的设计细节,可充分发挥该器件的性能。

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