WMSIC Electronic Components

FS32K146HAT0MLQT

ModelFS32K146HAT0MLQT
PackageLQFP-144(20x20)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP FS32K146HAT0MLQT
Type
NXP
Unit
Electronic Component
Minimum package
300 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
FS32K146HAT0MLQT
Electronic Component
1
Package
LQFP-144(20x20)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.35g
CPU
32 Bit
CPU
ARM Cortex-M4F
I / O
128
RAM
128KB
Electronic Component
1
ADC
12bit
DAC
8bit
EEPROM
4KB

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FS32K146HAT0MLQT 产品概述

一、产品简介

FS32K146HAT0MLQT 是恩智浦(NXP)面向高可靠性嵌入式控制应用的一款 32-bit MCU,内核采用 ARM Cortex-M4F,主频最高可达 80 MHz。器件集成大容量闪存与片上 RAM,支持宽供电电压与扩展 I/O,适用于工业控制、车用电子及高温工作环境的控制与信号处理任务。

二、核心性能

  • CPU 内核:ARM Cortex-M4F(含单精度浮点单元),32-bit 架构
  • 最大主频:80 MHz
  • 程序存储:1 MB FLASH(片内)
  • 工作 RAM:128 KB
  • EEPROM:4 KB(片内)

该配置在实时控制、滤波算法、通信协议处理等场景下具有良好的性能与存储能力,浮点单元利于控制算法与信号处理的高效实现。

三、片上外设与模拟能力

  • 通用 I/O 数量:128 个(高密度外设接口)
  • ADC:12-bit 分辨率(多通道采样,适合传感器接口)
  • DAC:8-bit 分辨率(简单模拟输出或 PWM 替代)
  • 振荡器:内置振荡器(适合低成本、快速上电方案)

丰富的 I/O 和 ADC 能够支持多路传感器采集、开关量与总线接口扩展;DAC 可用于简单模拟信号输出或校准用途。

四、电源与封装

  • 工作电压:2.7 V ~ 5.5 V(支持 3.3 V 与 5 V 系统兼容)
  • 工作温度:-40 ℃ ~ +125 ℃(适合严苛环境与车规级应用)
  • 封装形式:LQFP-144(20 x 20 mm)

宽电压范围与高温等级提供了系统设计上的灵活性,LQFP-144 封装便于手工焊接与批量生产测试。

五、典型应用场景

  • 工业自动化控制:运动控制、数据采集、PLC 辅助控制单元
  • 汽车电子(车规级环境考虑):车身控制模块、车载传感器采集与执行器驱动(需按系统级安全与认证评估)
  • 电机控制与伺服系统:利用浮点单元实现 PID、FOC 等控制算法
  • 智能传感器网关:多通道 ADC 与丰富 I/O 支持多传感器融合

六、设计要点与建议

  • 电源滤波与去耦:在 VDD/VSS 处使用合适的去耦电容,并在电源入口处加输入滤波以抑制瞬态干扰。
  • 时钟选择:内置振荡器适合简化设计,如需更高精度可外接晶振或参考时钟。
  • I/O 保护:若用于车规或工业现场,建议对关键 I/O 添加 TVS 二极管与串联限流保护。
  • 温度与封装:高温应用应关注焊接工艺与散热路径,遵循封装热阻规范。
  • 软件与引导:充分利用片内 FLASH 与 EEPROM 进行固件升级与参数存储,保证 OTA 或现场维护的可行性。

FS32K146HAT0MLQT 凭借均衡的计算能力、丰富的外设和耐高温宽压特性,是面向可靠性要求较高嵌入式控制系统的可行选择。在实际系统选型时,应结合整体功能需求、功耗预算与系统级认证要求进行评估与验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.