WMSIC Electronic Components

NVT2010BS,115 NVT2010BS

ModelNVT2010BS,115
PackageHVQFN-24-EP(4x4)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP NVT2010BS, 115
Type
NXP
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
NVT2010BS,115
Electronic Component
1
Package
HVQFN-24-EP(4x4)
Electronic Component
Converter / Level positions
Electronic Component
0.001g
Electronic Component
1
Electronic Component
1
Features
Output
Electronic Component
BM0265968506
Operating Temperature
40℃~+85℃
Data
33Mbps
Type
Electronic Component
Operating Voltage(VCCA)
1V~3.6V
Operating Voltage(VCCB)
1.8V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NVT2010BS,115 10通道双向电压电平转换器产品概述

一、核心身份与品牌背景

NVT2010BS,115是恩智浦半导体(NXP) 推出的一款高集成度双向电压电平转换器,专为解决不同电压域电子系统间的信号兼容问题设计。作为恩智浦电平转换产品线的典型器件,该型号凭借宽电压覆盖、自动方向检测等特性,广泛适配消费电子、工业控制、便携设备等多领域应用场景,依托恩智浦在半导体领域的可靠性技术积累,为系统设计提供稳定的电平桥接方案。

二、核心性能参数解析

该器件的核心参数围绕“跨电压域双向转换”优化,关键指标清晰适配主流系统需求:

  1. 双电源域电压覆盖:支持独立双电源供电,VCCA(端口A侧电源)范围为1V3.6V,覆盖低功耗MCU、物联网传感器等低压器件;VCCB(端口B侧电源)范围为1.8V5.5V,兼容传统5V外设、工业控制器等高压设备,实现从低压到高压的无缝桥接。
  2. 数据传输速率:最高支持33Mbps的数据速率,满足一般高速数字信号(如SPI扩展、UART通信等)的转换需求,无明显信号延迟或失真,适配中等速率的系统交互场景。
  3. 通道与集成度:单芯片集成1个电路、10个双向通道,无需额外扩展外围电路即可实现多线同步电平转换,减少PCB占用空间与设计复杂度,降低系统BOM成本。
  4. 输出模式灵活:支持开漏输出与推挽输出双模式,可根据应用场景切换:开漏模式适配I2C/SMBus等上拉总线,推挽模式适配高速点对点传输,覆盖更多总线类型。

三、关键特性与应用优势

NVT2010BS,115的核心优势集中在简化设计、宽适配性与可靠性:

  1. 自动方向检测:无需额外配置“方向控制引脚(DIR)”,器件可根据信号传输方向自动切换通道的输入/输出状态,大幅简化电路设计流程,减少MCU引脚资源占用,尤其适合双向通信场景。
  2. 双向无向转换:所有通道均为双向工作模式,信号可在端口A与端口B间自由传输,无需预先定义输入/输出方向,特别适配I2C、SMBus等双向总线的电平兼容需求。
  3. 宽温与小封装:工作温度范围为-40℃~+85℃(工业级温度),可满足户外、车载辅助系统、工业控制等恶劣环境需求;采用24-HVQFN(4×4mm) 超小型封装,适合便携设备、高密度PCB设计(如智能手表、工业控制模块)。
  4. 低功耗设计:器件本身功耗极低,适配低功耗系统(如物联网节点、可穿戴设备),不会额外增加系统功耗负担。

四、典型应用场景

该器件的宽电压覆盖与灵活特性,使其适配以下典型场景:

  1. 跨电压域通信:低功耗1V MCU与3.3V传感器、5V legacy外设的连接(如物联网节点与传统工业传感器)。
  2. 双向总线转换:I2C、SMBus等双向总线的电压电平桥接(如1.8V MCU与3.3V I2C外设)。
  3. 便携电子设备:智能手机、平板、智能手表等小型化设备的内部电压域桥接(小封装+宽电压)。
  4. 工业控制模块:工业传感器(3.3V)与PLC控制器(5V)的信号兼容(宽温范围)。
  5. 消费电子外设:USB HUB、音频接口等外设与主机的电压适配(双电源域兼容)。

五、总结

NVT2010BS,115作为恩智浦的高集成度双向电平转换器,凭借10通道双向转换、自动方向检测、宽电压覆盖(1V~5.5V)、工业级宽温 等核心特性,成为解决不同电压域系统兼容问题的理想选择。其小封装与低功耗设计,进一步适配了便携设备与高密度PCB的需求,在消费电子、工业控制、物联网等领域具有广泛的应用价值,可有效简化系统设计流程,提升产品可靠性。

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