WMSIC Electronic Components

LPC802M001JDH16J

ModelLPC802M001JDH16J
PackageTSSOP-16
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP LPC802M001JDH16J
Type
NXP
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
LPC802M001JDH16J
Electronic Component
1
Package
TSSOP-16
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.21g
CPU
32 Bit
CPU
ARM Cortex-M0+
I / O
13
RAM
2KB
Electronic Component
1
ADC
12bit
Electronic Component
BM0262715420
Operating Temperature
40℃~+105℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LPC802M001JDH16J 产品概述

一、概述

LPC802M001JDH16J 是恩智浦(NXP)面向低功耗、成本敏感嵌入式应用推出的一款基于 ARM Cortex‑M0+ 内核的 32 位微控制器。该器件主频最高可达 15 MHz,片内配备 16 KB 的 Flash 程序存储与 2 KB 的 SRAM,提供 13 路通用 I/O 和 12‑bit ADC,内置振荡器,工作电压范围 1.71 V 至 3.6 V,工作温度覆盖 -40 ℃ 至 +105 ℃,封装为 TSSOP‑16,适合体积受限且需低功耗的控制与采集场合。

二、主要规格

  • CPU:ARM Cortex‑M0+,32 bit,最高 15 MHz
  • 存储:16 KB Flash 程序存储器;2 KB SRAM
  • I/O:13 路通用 I/O(GPIO)
  • 模拟输入:12‑bit ADC(用于传感器采样)
  • 时钟:内置振荡器(无需外部晶振即可工作)
  • 电源:工作电压 1.71 V ~ 3.6 V
  • 温度:工作温度范围 -40 ℃ ~ +105 ℃
  • 封装:TSSOP‑16
  • 品牌:NXP(恩智浦)

三、关键特性与优势

  • 小封装、低成本:TSSOP‑16 封装便于在有限 PCB 面积上实现 MCU 功能,适合批量生产与成本敏感型产品。
  • 适用宽电压与宽温度:1.71 V ~ 3.6 V 的供电范围和工业级温度范围,使其可用于电池供电和工业环境。
  • 集成 ADC 与内置振荡器:12‑bit ADC 有利于对模拟传感器进行高精度采样;内置振荡器降低了外设元件数量和系统成本。
  • 低功耗控制能力:基于 Cortex‑M0+ 的简洁架构适合实现节能运行模式,适用于便携和长寿命电池供电的产品。

四、典型应用场景

  • 传感器数据采集与前端处理(温湿度、光照、压力等)
  • 简单控制器与驱动(家电控制、小型伺服/电机控制)
  • 电池供电设备与可穿戴式终端(低功耗要求)
  • 工业现场的简单监测模块与数据采集单元
  • 嵌入式外围接口桥接、逻辑控制与状态指示

五、硬件设计与工程注意事项

  • 电源与去耦:在 VDD 引脚附近放置 0.1 μF 陶瓷去耦电容,并考虑 1 μF~10 μF 的旁路电容以平滑供电。
  • ADC 采样:为获得稳定的 ADC 读数,应对模拟输入做源阻抗控制与输入滤波,必要时加入缓冲放大器或采样电容。
  • 时钟选择:器件具备内置振荡器,可在多数场合省略外部晶振;对需高精度定时的应用,评估是否需外部时钟源。
  • I/O 使用:13 路 I/O 适合多数控制与显示用途,但在设计时应规划好多功能引脚的分配,避免资源冲突。
  • 封装与焊接:TSSOP‑16 在手板与小批量生产中易于加工,注意焊接工艺与热管理。

六、开发与生产建议

  • 软件开发:可使用 NXP 官方工具链(如 MCUXpresso)或常用 GCC 工具链进行固件开发与调试。
  • 功能验证:在样机阶段重点验证 ADC 精度、低电压下性能、功耗以及在高低温极限下的稳定性。
  • 量产考虑:评估封装、测试治具以及程序烧录方案,提前规划生产性能及可靠性测试项目。

综上,LPC802M001JDH16J 以其紧凑封装、可靠的模拟采集能力和工业级工作范围,适用于体积受限、成本敏感且对温度与供电要求严格的嵌入式应用场景。

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