Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LPC802M001JDH20J是恩智浦(NXP)推出的一款基于ARM Cortex-M0+内核的32位单片机(MCU),专为小型嵌入式应用设计,兼顾性能、成本与环境适应性,广泛适用于工业控制、传感器节点、消费电子等场景。
该产品的核心参数如下:
ARM Cortex-M0+内核是ARM针对低功耗、低成本应用优化的32位内核,相比传统8位单片机(如AVR、PIC),在相同功耗下可提供更高的运算效率——15MHz主频可满足小型控制逻辑、简单数据处理(如传感器数据滤波、协议解析)需求,同时保持极低的待机功耗,适合电池供电场景。
16KB FLASH可存储小型应用程序(如基础控制代码、简单通信协议),支持在线编程(ISP)便于批量烧录;2KB RAM可满足堆栈、变量存储需求,对于单任务或轻量级多任务应用(如轮询传感器+控制输出)足够支撑。
适用于继电器开关控制、小功率电机驱动(如微型泵、小型风扇)、工业传感器接口模块等场景。宽温特性可应对车间、户外设备柜等环境,17个I/O可满足多通道控制需求。
如环境监测(温度、湿度、光照强度)、工业现场电压电流监测等。12位ADC实现精准模拟量采集,Cortex-M0+低功耗特性支持电池供电长期运行(如纽扣电池供电可工作数月)。
用于小家电(加湿器、香薰机、小型夜灯)的控制模块,TSSOP-20封装可嵌入小型产品外壳,成本优势显著;也可作为智能家居设备的辅助控制单元(如智能插座的状态监测)。
虽未明确标注车规认证,但-40℃~+105℃的温度范围接近车规AEC-Q100要求,可用于车载辅助设备(如车内传感器接口、小功率LED控制)。
Cortex-M0+内核的32位性能比8位机提升显著,但价格接近传统8位单片机,是替代8位机、提升系统性能的高性价比选择。
内置振荡器减少外部元件,TSSOP-20封装缩小PCB尺寸,降低了硬件设计与制造成本,适合批量生产。
恩智浦提供LPCXpresso开发环境(免费版支持16KB FLASH)、官方例程与技术文档,开发门槛低,可快速完成原型验证与量产。
LPC802M001JDH20J以其紧凑设计、宽适应性与高性价比,成为小型嵌入式应用的理想解决方案,可有效满足工业、消费电子等领域的基础控制与监测需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products