WMSIC Electronic Components

LPC802M001JDH20J

ModelLPC802M001JDH20J
PackageTSSOP-20
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 21+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP LPC802M001JDH20J
Type
NXP
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
LPC802M001JDH20J
Electronic Component
1
Package
TSSOP-20
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.11g
CPU
32 Bit
CPU
ARM Cortex-M0+
I / O
17
RAM
2KB
Electronic Component
1
ADC
12bit
Electronic Component
BM0264920861
Operating Temperature
40℃~+105℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LPC802M001JDH20J 单片机产品概述

LPC802M001JDH20J是恩智浦(NXP)推出的一款基于ARM Cortex-M0+内核的32位单片机(MCU),专为小型嵌入式应用设计,兼顾性能、成本与环境适应性,广泛适用于工业控制、传感器节点、消费电子等场景。

一、核心性能参数概览

该产品的核心参数如下:

  • 处理器内核:ARM Cortex-M0+(低功耗32位内核)
  • 主频:最大15MHz(满足小型运算需求)
  • 存储资源:16KB FLASH(程序存储)+ 2KB RAM(数据临时存储)
  • I/O资源:17个通用输入输出引脚
  • 模拟外设:12位分辨率ADC
  • 时钟系统:内置振荡器(无需外部晶振)
  • 电源与温度:工作电压1.71V3.6V,工作温度-40℃+105℃
  • 封装形式:TSSOP-20(20引脚薄型小外形封装)

二、关键硬件特性解析

1. 低功耗内核与运算能力

ARM Cortex-M0+内核是ARM针对低功耗、低成本应用优化的32位内核,相比传统8位单片机(如AVR、PIC),在相同功耗下可提供更高的运算效率——15MHz主频可满足小型控制逻辑、简单数据处理(如传感器数据滤波、协议解析)需求,同时保持极低的待机功耗,适合电池供电场景。

2. 紧凑的存储配置

16KB FLASH可存储小型应用程序(如基础控制代码、简单通信协议),支持在线编程(ISP)便于批量烧录;2KB RAM可满足堆栈、变量存储需求,对于单任务或轻量级多任务应用(如轮询传感器+控制输出)足够支撑。

3. 实用的外设资源

  • 12位ADC:支持模拟量采集(如温度、电压、电流),精度满足大多数工业与消费电子场景的监测需求;
  • 内置振荡器:无需外部晶振,减少BOM成本与PCB布局空间,简化系统设计;
  • TSSOP-20封装:引脚间距0.65mm,体积紧凑,适合小型化产品(如穿戴设备、小型控制器)。

4. 宽范围的环境适应性

  • 宽电压支持:覆盖1.71V~3.6V,可兼容单节锂电池(3.7V)、纽扣电池(2V左右)及3.3V稳压电源,无需额外电源转换电路;
  • 工业级温度:-40℃~+105℃的工作范围,可稳定运行于户外、工业现场等恶劣环境,避免因温度波动导致的性能下降。

三、典型应用场景

1. 小型工业控制单元

适用于继电器开关控制、小功率电机驱动(如微型泵、小型风扇)、工业传感器接口模块等场景。宽温特性可应对车间、户外设备柜等环境,17个I/O可满足多通道控制需求。

2. 低功耗传感器节点

如环境监测(温度、湿度、光照强度)、工业现场电压电流监测等。12位ADC实现精准模拟量采集,Cortex-M0+低功耗特性支持电池供电长期运行(如纽扣电池供电可工作数月)。

3. 消费电子辅助控制

用于小家电(加湿器、香薰机、小型夜灯)的控制模块,TSSOP-20封装可嵌入小型产品外壳,成本优势显著;也可作为智能家居设备的辅助控制单元(如智能插座的状态监测)。

4. 车载周边小型设备

虽未明确标注车规认证,但-40℃~+105℃的温度范围接近车规AEC-Q100要求,可用于车载辅助设备(如车内传感器接口、小功率LED控制)。

四、产品优势与设计价值

1. 性能与成本的平衡

Cortex-M0+内核的32位性能比8位机提升显著,但价格接近传统8位单片机,是替代8位机、提升系统性能的高性价比选择。

2. 设计简化与成本控制

内置振荡器减少外部元件,TSSOP-20封装缩小PCB尺寸,降低了硬件设计与制造成本,适合批量生产。

3. 开发资源丰富

恩智浦提供LPCXpresso开发环境(免费版支持16KB FLASH)、官方例程与技术文档,开发门槛低,可快速完成原型验证与量产。

LPC802M001JDH20J以其紧凑设计、宽适应性与高性价比,成为小型嵌入式应用的理想解决方案,可有效满足工业、消费电子等领域的基础控制与监测需求。

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