Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
NT3H2111W0FT1X
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP NT3H2111W0FT1X
- Type
- NXP
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ISO 14443A,NFC
- Electronic Component
- NXP
- Electronic Component
- NT3H2111W0FT1X
- Electronic Component
- 1
- Package
- SO-8
- Electronic Component
- RF Card IC
- Electronic Component
- 0.17g
- Frequency
- 13.56MHz
- Electronic Component
- 1
- Electronic Component
- 106Kbit/s；40Kbit/s
- Features
- Acquisition; Built-in; Data
- Electronic Component
- BM0058398911
- Operating Voltage
- 3.3V
- Interface Type
- I2C
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NT3H2111W0FT1X 产品概述
1. 产品概述
NT3H2111W0FT1X是一款由恩智浦（NXP）公司制造的高性能RFID应答器，专为支持13.56MHz频段的ISO 14443标准应用而设计。该产品以紧凑的8-SOIC封装形式提供，适合于各种表面贴装的应用，尤其在需要小型化和高效集成的环境下表现优越。
2. 关键特性
NT3H2111W0FT1X具备多项关键特性，使其适用于多种智能识别与数据传输场景：
频率与标准：支持13.56MHz的频段，符合ISO 14443标准，能够实现快速读写操作，适用于非接触式数据交换。
接口及兼容性：器件通过I²C接口与外部微控制器或系统集成，简化了设计流程，便于与其他设备的兼容性。
电压与功耗：该应答器的供电电压范围在3.3V，具有良好的功耗性能，适合于电池供电的便携设备及多种电子应用。
温度范围：NT3H2111W0FT1X的工作温度范围广泛，支持-40°C到105°C的环境，确保其在各种恶劣条件下稳定运行，特别适合工业及户外设备。
小巧封装：8-SOIC封装（0.154"宽，3.90mm）使得该IC能够轻易集成到空间有限的设计中，降低了PCB的整体尺寸。
3. 应用场景
NT3H2111W0FT1X广泛适用于以下几种应用场景：
智能卡与支付系统：凭借其快速的读取功能和ISO 14443标准的兼容性，NT3H2111W0FT1X可在公交卡、信用卡及其他金融支付工具中发挥重要作用。
门禁系统：适合用于各类门禁控制系统，通过非接触式的卡片读取，实现安全且高效的进入控制。
物流与追踪：在物流行业中，NT3H2111W0FT1X能够用于资产跟踪、物品识别，提高供应链效率。
物联网（IoT）设备：由于其小巧的封装尺寸与低功耗特性，NT3H2111W0FT1X特别适合于需要RFID标签的物联网设备，如智能家居、智能电表等。
医疗与健康：在医疗器械及健康管理中，NT3H2111W0FT1X可实现患者身份识别、药品追踪等功能，提升医疗服务效率与安全性。
4. 技术参数
- 封装类型：8-SOIC
- 频率：13.56MHz
- 交互标准：ISO 14443
- 接口类型：I²C
- 供电电压：3.3V
- 工作温度：-40°C至105°C
5. 结论
NT3H2111W0FT1X是一个高效且灵活的RFID应答器，凭借其出色的技术参数和广泛的适用性，成为了现代非接触式应用的理想选择。无论是在金融、物流、医疗还是物联网等领域，NT3H2111W0FT1X都能显著提升产品的功能性与性能可靠性，为各种电子产品的设计与实现提供了坚实的基础。选择NT3H2111W0FT1X，不仅能优化成本结构，还可缩短上市时间，非常适合追求创新和效率的技术开发者和工程师。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
