WMSIC Electronic Components

FS32K144HAT0MLLT

ModelFS32K144HAT0MLLT
PackageLQFP-100(14x14)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP FS32K144HAT0MLLT
Type
NXP
Minimum package
450 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
FS32K144HAT0MLLT
Electronic Component
1
Package
LQFP-100(14x14)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.67g
CPU
32 Bit
CPU
ARM Cortex-M4F
I / O
89
RAM
64KB
Electronic Component
1
ADC
12bit
DAC
8bit
EEPROM
4KB
Electronic Component
BM0231133162

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FS32K144HAT0MLLT 产品概述

FS32K144HAT0MLLT 是恩智浦(NXP)面向工业级与汽车电子等高可靠性应用的32位微控制器。该器件基于 ARM Cortex‑M4F 内核,主频可达 80 MHz,集成丰富片上资源与模拟外设,工作电压范围宽(2.7V–5.5V)并支持工业级温度(-40℃ 至 +125℃),适合对计算性能、模拟采集与工作环境有较高要求的嵌入式系统。

一、核心性能概述

  • CPU 内核:ARM Cortex‑M4F,支持单精度浮点运算,适合需要控制算法和数字信号处理的场合。
  • 最大主频:80 MHz,32 位运算能力满足中高实时控制需求。
  • 程序存储:512 KB Flash,可容纳复杂固件与引导加载器设计。
  • 内部存储:64 KB RAM 与 4 KB EEPROM 用于运行时数据与持久化参数存储。

二、片上资源与外设

FS32K144HAT0MLLT 提供丰富的片上外设,适配多种接口与传感器:

  • I/O 数量:89 路通用 I/O,方便大规模信号接入与外设扩展。
  • ADC:12-bit 分辨率,适合高精度模拟信号采集(传感器、测量电路)。
  • DAC:8-bit,满足基础模拟输出需求。
  • 时钟:内置振荡器,简化系统时钟设计与上电管理。
  • 其它外设:常见的定时器、串行接口(如 UART、SPI、I2C 等)及中断控制,便于通信与外设驱动(具体外设请参考完整数据手册)。

三、电气特性与可靠性

  • 工作电压:2.7 V 至 5.5 V,支持单电源供电并兼容 3.3V 与 5V 外设接口,便于工程设计与系统集成。
  • 工作温度范围:-40℃ 至 +125℃,满足工业与车规级环境对温度耐受的要求。
  • 可靠性:恩智浦器件在制造与质量控制上具备行业经验,适用于对长期稳定性有要求的产品。

四、封装与布局

  • 封装形式:LQFP‑100(14 × 14 mm),适合中小批量手板与量产 PCB 布局。
  • 引脚数充裕,有利于将 I/O、模拟与电源引脚分区布线,降低干扰、提升信号完整性。

五、典型应用场景

  • 工业控制:PLC 扩展、运动控制器、数据采集模块等需要实时控制与高可靠性的场合。
  • 汽车电子(非安全关键或符合相应认证条件的子系统):车身控制、仪表、传感器前端处理等。
  • 仪器仪表:便携或台式测量设备、过程监控系统、环境数据记录器。
  • 智能终端与物联网网关:边缘计算节点、网关设备,结合浮点运算用于信号滤波与简单的本地分析。

六、设计建议与开发支持

  • 电源设计:鉴于器件支持 2.7V–5.5V,推荐使用稳定的 3.3V 供电以兼容常见外设并降低功耗;注意电源去耦与上电顺序。
  • 模拟前端:12-bit ADC 要求良好的 PCB 布局与参考地分配,避免数字噪声影响采样精度;若高精度需求,可考虑外部 ADC。
  • 时钟策略:内置振荡器适用于多数场景,如需严格时序或低抖动,考虑外部晶振或时钟源。
  • 软件与工具链:可使用基于 Cortex‑M4 的常见开发工具链、IDE 与调试器;建议参考恩智浦提供的 SDK、示例代码与驱动库以缩短开发周期。

七、总结

FS32K144HAT0MLLT 在性能、片上资源与工业级电气特性之间取得平衡,512 KB Flash 与 64 KB RAM 为中复杂度应用提供足够空间,ARM Cortex‑M4F 的浮点能力提升了控制与信号处理效率。其宽电压与高温特性使其在工业与车规类项目中具有竞争力。设计时注重模拟信号链与电源完整性,并利用厂家提供的开发支持,可高效实现稳定可靠的产品。若需更详细的引脚分配、电气参数与外设说明,请参阅恩智浦官方数据手册与应用笔记。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.