WMSIC Electronic Components

TJA1044GTJ

ModelTJA1044GTJ
PackageSOIC-8
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP TJA1044GTJ
Type
NXP
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
TJA1044GTJ
Electronic Component
1
Package
SOIC-8
Type
CAN-FDTransceiver
Electronic Component
CAN Transceiver
Electronic Component
0.144g
Electronic Component
1
Channel Count
1
Features
Integrated Level positions; ESD; TXD;; Low Power
Electronic Component
BM0258756405
Operating Temperature
40℃~+150℃
Operating Voltage
4.75V~5.25V
Operating Current
60mA
Data
5Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TJA1044GTJ 产品概述

一、简介

TJA1044GTJ 是恩智浦(NXP)推出的一款单通道 CAN-FD 收发器,采用 SOIC-8 封装,面向汽车与工业总线环境。该器件在 5V 工作电源下可支持高达 5 Mbps 的 CAN-FD 数据速率,同时提供超低待机电流和宽温度工作范围,适用于要求可靠性与耐热性的严苛应用场景。

二、主要参数

  • 类型:CAN-FD 收发器(单通道)
  • 数据速率:最高 5 Mbps
  • 工作电压:4.75 V ~ 5.25 V
  • 工作电流(活动):典型 60 mA
  • 静态/待机电流:15 μA(低功耗模式)
  • 工作温度:-40 ℃ ~ +150 ℃
  • 封装:SOIC-8(8 引脚)
  • 品牌:NXP(恩智浦)

三、关键特性与优势

  • 高速 CAN-FD 支持:满足 5 Mbps 数据速率需求,适合带有扩展帧与更高吞吐量的现代汽车网络。
  • 低功耗待机:15 μA 的静态电流,便于在整车休眠或低功耗状态下减少能耗。
  • 宽温度范围:最高达 +150 ℃,适合发动机舱等高温应用,提升系统可靠性。
  • 标准封装与接口:SOIC-8 封装便于生产与替换,同类控制器/MCU 易于对接。
  • 稳定的电源与驱动性能:在 4.75–5.25 V 的电源范围内保持稳定通信与容错能力。

四、典型应用场景

  • 汽车车身电子(车灯控制、车门模块、车身网关)
  • 动力总成及发动机舱网络(要求耐高温)
  • 车载诊断与通讯模块(Gateway、ECU)
  • 工业控制总线系统(需要高可靠通信与低待机功耗)

五、设计与使用建议

  • 电源旁路:在 VCC 近端放置 0.1 μF 陶瓷电容与 1 μF 以上电解/钽电容组合作为稳压与瞬态滤波。
  • 总线终端:在 CAN_H 与 CAN_L 之间采用 120 Ω 终端电阻(或根据系统设计选择等效阻抗),并在节点布局上保持终端在总线两端。
  • EMI/EMC 和布局:将收发器靠近终端及变换器放置,缩短 CAN_H/CAN_L 的差分走线并对称布线,必要时添加共模电感与 TVS 抑制器以提高抗干扰性与浪涌保护。
  • 低功耗模式:使用待机/休眠引脚进入静态电流 15 μA 状态以降低整车静态耗电,唤醒时注意总线复位与同步。
  • 接口兼容性:TX/RX 与微控制器之间按典型逻辑电平对接,注意保护 MCU 免受总线瞬态影响(建议在敏感输入处使用滤波或限流措施)。
  • 散热与可靠性:虽然 SOIC-8 无外露散热垫,但在高温环境下应保证 PCB 热阻管理与合理布线以避免长期热应力。

六、封装与可靠性

TJA1044GTJ 的 SOIC-8 封装便于自动化贴装与替换,适配常见 PCB 工艺。器件的高温等级(-40 ℃ 至 +150 ℃)表明其针对汽用级与工业级可靠性做了优化,但在具体项目中仍建议参考官方数据手册的有限条款、热阻与耐压极限进行设计验证与整车级测试。

总结:TJA1044GTJ 以其 5 Mbps 的 CAN-FD 支持、低待机功耗与宽温度适应能力,适合用于对速度、能耗与耐热性有较高要求的汽车与工业网络节点。详细电气特性、引脚定义和典型工作曲线请以 NXP 官方数据手册为准并结合系统级 EMC/热仿真完成最终硬件设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.