WMSIC Electronic Components

S9S12G48BCLC

ModelS9S12G48BCLC
PackageLQFP-32(7x7)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP S9S12G48BCLC
Type
NXP
Unit
Electronic Component
Minimum package
1250 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
S9S12G48BCLC
Electronic Component
1
Package
LQFP-32(7x7)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.001g
I / O
26
Electronic Component
1
ADC
10bit
Electronic Component
BM0265368665
Operating Voltage
3.13V~5.5V
CPU
25MHz
Electronic Component
Electronic Component
Electronic Component
1250

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S9S12G48BCLC 16位MCU产品概述

一、核心定位与品牌背景

S9S12G48BCLC是恩智浦(NXP)推出的16位微控制器(MCU),隶属于S9S12G系列。该系列延续恩智浦在工业控制与嵌入式领域的技术积累,以高性价比、稳定可靠为核心优势,适配对16位运算能力有需求但成本敏感的应用场景。其核心架构基于成熟的HCS12内核,兼顾性能与兼容性,是中小规模嵌入式系统的优选方案。

二、核心运算性能

该MCU搭载16位HCS12中央处理器,最大主频可达25MHz,支持单周期指令执行(部分指令),在相同主频下可实现比8位MCU更高的运算效率。HCS12内核优化了控制类指令集,适合电机调速、数据滤波、实时中断响应等需要快速处理的场景,满足多数工业与消费电子的实时控制需求。

三、存储体系配置

存储体系包含两大核心部分:

  1. 程序存储器:内置48KB FLASH,支持在线串行编程(ISP),可通过UART等接口实现固件远程升级,无需拆卸芯片,大幅提升产品维护便利性;FLASH具备长擦写寿命(典型值10万次以上),满足多次程序更新需求。
  2. 数据存储器:内置RAM(具体容量参考官方 datasheet),用于临时数据存储与栈操作,保障程序运行时的变量、寄存器数据安全,支持动态数据处理与函数调用。

四、I/O与外设接口

  • 通用I/O口:共26个可编程I/O引脚,支持输入/输出方向配置、上拉/下拉电阻使能,部分引脚可配置为中断输入,响应外部事件的实时触发(如按键、传感器信号)。
  • 通信与控制外设:内置多路定时器/计数器(用于PWM输出、定时中断)、常见通信接口(如UART、SPI、I2C等,具体数量与功能需参考官方文档),可实现与传感器、执行器、其他MCU的互联互通,简化系统组网设计。

五、模拟信号处理能力

内置10位分辨率ADC,支持多通道模拟信号采集(通道数参考官方 datasheet),采样精度满足多数工业传感器(如温度、压力、光强传感器)的信号转换需求。ADC可配置为单次采样或连续采样模式,配合定时器实现定时采集,无需额外外部电路即可完成模拟数据到数字信号的转换。

六、电源与封装规格

  • 电源特性:工作电压范围为3.13V~5.5V,宽电压设计适配不同电源环境(如电池供电、稳压电源),降低电源电路设计复杂度,提升系统抗干扰能力。
  • 封装形式:采用32-LQFP(7×7mm) 表面贴装封装,体积紧凑,适合小型化产品(如手持设备、嵌入式模块)的PCB布局;引脚间距0.8mm,便于焊接与布线,兼顾生产效率与空间利用率。

七、典型应用场景

S9S12G48BCLC的性能与成本平衡,使其适配以下场景:

  1. 小型工业控制:如小型电机驱动、温度/湿度控制系统、小型PLC子模块;
  2. 消费电子:智能家居节点(如灯光控制、环境监测)、小型手持设备(如数据采集仪);
  3. 汽车电子辅助:若符合汽车级认证(需参考官方认证信息),可用于车身控制子系统、传感器节点(如胎压监测辅助模块);
  4. 物联网边缘节点:低功耗模式下(若支持,需参考 datasheet)可用于电池供电的物联网节点,实现数据采集与简单控制。

注意:以上部分参数(如RAM容量、ADC通道数、外设具体数量)需以恩智浦官方发布的 datasheet 为准,本概述仅基于公开基础参数整理。

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