WMSIC Electronic Components

PCA9702PW,118 PCA9702PW

ModelPCA9702PW,118
PackageTSSOP-16
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP PCA9702PW, 118
Type
NXP
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCA9702PW,118
Electronic Component
1
Package
TSSOP-16
Electronic Component
I / O Expander
Electronic Component
0.272g
Electronic Component
1
I / O
8
Features
and
Electronic Component
BM0257221795
Operating Temperature
40℃~+125℃
Operating Voltage
2.5V~5.5V
Interface Type
SPI
Current(IOL)
6mA
Clock Frequency(fc)
5MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCA9702PW,118 产品概述

一、产品简介

PCA9702PW,118 是恩智浦(NXP)推出的一款八路 I/O 扩展器(仅输入),通过 SPI 串行接口与主控通信,最大时钟频率可达 5 MHz,封装为 TSSOP-16。器件工作电压范围宽(2.5 V 至 5.5 V),工作温度覆盖工业级(-40 ℃ 至 +125 ℃),静态电流典型值仅 1 μA,适用于低功耗、工业和消费类系统的数字输入扩展需求。

二、主要功能与特点

  • 8 路独立输入通道,适合按键、开关、传感器等多点输入采集。
  • SPI 串行接口,时钟频率最高 5 MHz,支持标准 SPI 主从通信拓扑,节省 MCU 引脚。
  • 带中断输出,引脚状态变化可触发中断,降低主控轮询开销,提高响应速度。
  • 宽电源范围 2.5 V–5.5 V,与 3.3 V 与 5 V 系统兼容。
  • 低静态电流(Iq ≈ 1 μA),适合电池供电与省电场景。
  • 封装:TSSOP-16,节省 PCB 面积,适合集成化设计。
  • 工作温度 -40 ℃ 至 +125 ℃,满足工业环境要求。

三、电气与性能要点

  • I/O 数量:8(仅输入)。
  • 中断输出:支持,便于事件驱动型设计。
  • 灌电流(IOL):6 mA(需注意此项通常与输出驱动或中断输出能力相关,在设计外部上拉/下拉时应留意器件承载)。
  • 时钟频率(fc):最高 5 MHz,满足中高速数据传输需求。
  • 静态电流(Iq):约 1 μA,有利于待机功耗优化。
  • 温度等级:-40 ℃–+125 ℃,适合严苛环境。

四、接口与时序建议

PCA9702 通过 SPI 与主控通信,建议:

  • 在 PCB 走线时尽量缩短 SCLK、MOSI、MISO(若有)和 CS 的长度,必要时增加串联阻抗或差分技巧以抑制反射。
  • 根据系统总线速率选择合适的上拉/下拉电阻,保证输入端在未驱动时有确定电平。
  • 中断线建议与 MCU 的外部中断输入连接,并在中断服务程序中尽快读取器件寄存器以清除中断源,避免漏判。

五、布局与可靠性注意事项

  • 电源引脚附近放置 0.1 μF 陶瓷去耦电容,靠近引脚焊盘布置以降低寄生电感与噪声。
  • 输入端若接长线或开关,建议加 RC 抗扰滤波或 TVS 抗静电保护,延长器件寿命并提高系统抗干扰性。
  • TSSOP-16 封装焊盘设计遵循厂方推荐焊盘尺寸与回流曲线,保证焊接可靠性。
  • 高温或高湿环境下,注意清洗与涂层选择以防腐蚀。

六、典型应用场景

  • 工业控制面板:按键矩阵、状态监测输入扩展。
  • 家电控制:多按键与传感器输入集中读取。
  • 便携与电池设备:低功耗输入扩展,延长待机时间。
  • 仪表与嵌入式系统:有限 MCU 引脚情况下的数字输入扩展。

结论:PCA9702PW,118 以其低功耗、宽压供电、工业级温度范围和带中断的 SPI 接口,适合需要可靠输入扩展且对功耗与封装面积有要求的设计。设计时关注去耦、输入防护和中断处理可以获得稳定可靠的系统表现。

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