WMSIC Electronic Components

TJA1028TK/5V0/20/1 TJA1028TK

ModelTJA1028TK/5V0/20/1
PackageHVSON-8(3x3)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP TJA1028TK / 5V0 / 20 / 1
Type
NXP
Minimum package
6000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
TJA1028TK/5V0/20/1
Electronic Component
1
Package
HVSON-8(3x3)
Type
Transceiver
Electronic Component
LIN Transceiver
Electronic Component
0.05g
Electronic Component
1
Features
TXD; Bus; Low Power
Electronic Component
BM0254942632
Operating Temperature
40℃~+150℃
Operating Voltage
4.9V~5.1V
Operating Current
4.5mA
Receiver
1
Static Current
45uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TJA1028TK/5V0/20/1 产品概述

一、产品简介

TJA1028TK/5V0/20/1 是恩智浦(NXP)推出的一款LIN收发器(Single LIN transceiver),集成一路驱动器和一路接收器,专为车载局域网(Local Interconnect Network, LIN)节点设计。该器件支持标准的5 V供电,拥有低功耗和宽温度范围,适用于车内环境苛刻、对可靠性要求高的应用场景。小型HVSON-8 (3×3 mm) 封装利于在空间受限的电子控制单元(ECU)上实现高密度布局。

二、主要特性

  • 单通道收发器:1 路驱动器、1 路接收器,满足单节点 LIN 通讯需求。
  • 工作电压:4.9 V ~ 5.1 V,专为标准 5 V 车辆电源系统优化。
  • 接收器滞后(Hysteresis):200 mV,增强抗噪声能力,提高总线抗干扰稳定性。
  • 工作电流:约 4.5 mA(通讯/活动模式下),实现较低的动态功耗。
  • 静态/休眠电流:45 μA,支持低功耗待机,利于整车能耗管理。
  • 工作温度范围:-40 ℃ ~ +150 ℃,适配高温汽车电子应用(按器件规格书确认具体环境与封装限制)。
  • 静电防护:±8 kV(人体模型级别),增强现场装配与维护中的抗静电能力。
  • 封装:HVSON-8 (3×3 mm),占板面积小,适合高密度 PCB 设计。

三、典型应用场景

  • 车门控制模块、车窗和座椅调节单元等车身电子控制单元(Body ECUs)。
  • 仪表盘、信息娱乐子系统与舒适性控制模块的 LIN 网络节点。
  • 传感器或执行器附近需要的本地 LIN 接口,例如温度/位置传感器驱动。
  • 对空间与功耗有严格限制的嵌入式系统和工业局部网络。

四、电气与热参数要点

该收发器在典型工作状态下表现出低功耗特性:活动模式下工作电流约 4.5 mA,而静态或休眠模式下电流可低至 45 μA,有助于整车待机功耗优化。接收器具有 200 mV 的滞后,有利于滤除总线上短脉冲干扰和切换抖动。工作电压窄范围(4.9–5.1 V)提示设计时应保证电源稳压与去耦良好,避免电源瞬态导致通讯异常。器件可在 -40 ℃ 至 +150 ℃ 环境下工作,但在系统设计时应结合热阻、PCB 散热条件以及封装热特性进行热管理评估,确保长期可靠性。

五、封装与 PCB 布局建议

  • HVSON-8(3×3)小型封装节省空间,但由于封装尺寸小,建议在 PCB 设计时重视散热路径:将芯片底部裸露金属焊盘(若有)焊接到 PCB 的地平面,并通过过孔与多层地铜相连以提高散热能力。
  • 在电源引脚附近放置合理的去耦电容(例如 0.1 μF + 1 μF 的组合),靠近芯片布置,降低电源噪声并避免瞬态压降。
  • LIN 总线(BUS)线应尽量采取差分走线隔离敏感信号,布线避免与大电流回路平行,减小耦合噪声。
  • 接地策略:采用单点或星形接地以减少地环路;关键模拟与数字地应合理分割并在靠近器件处汇合。
  • 对于工业或车载环境,建议在总线端加入适当的浪涌/浪涌抑制元件和过压保护器件,以保护收发器免受电磁干扰和瞬态过电压影响。

六、设计与系统集成注意事项

  • 遵循 LIN 物理层规范进行终端匹配与网络拓扑设计;选择合适的总线终端和上拉策略以保证节点在休眠与唤醒状态间切换正常。
  • 由于器件要求较窄的供电电压范围,建议系统采用稳压器或聚合电源管理策略,保证在发动机启停或电压短时跌落时对收发器供电稳定。
  • 对于需要快速唤醒的系统,评估器件从休眠到活动的唤醒时间并与上层微控制器(MCU)协调。
  • 在高温或振动苛刻环境中应进行长时间可靠性测试,验证焊接工艺和 PCB 材料对封装的兼容性。

七、可靠性与合规性

TJA1028TK/5V0/20/1 以其宽工作温度与较强的静电防护能力适配车规级应用。在车载环境设计中,建议开发阶段实现 ESD、EMC、热冲击与机械应力的验证,确保整车级稳定性。最终产品应按汽车行业相关标准进行测试与验证,满足整车厂的质量与安全要求。

总结:TJA1028TK/5V0/20/1 是一款小型、低功耗且适应车载高温环境的 LIN 单通道收发器,适用于车身控制与各类空间受限的 LIN 节点。合理的电源滤波、PCB 布局与热管理是确保其在实际系统中稳定运行的关键。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.