WMSIC Electronic Components

PCA8574APW,118 PCA8574APW

ModelPCA8574APW,118
Package16-TSSOP
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP PCA8574APW, 118
Type
NXP
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCA8574APW,118
Electronic Component
1
Package
16-TSSOP
Electronic Component
I / O Expander
Electronic Component
0.168g
Electronic Component
1
I / O
8
Features
Built-in LEDDriver; positions; and
Electronic Component
BM0263489625
Operating Temperature
40℃~+85℃
Operating Voltage
2.3V~5.5V
Interface Type
I2C
Current(IOL)
25mA
Clock Frequency(fc)
400kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCA8574APW,118 I/O扩展器产品概述

一、核心身份与品牌背书

PCA8574APW,118是恩智浦(NXP)推出的8位双向I/O扩展器,基于I2C串行接口设计,属于工业级高性能外设系列。恩智浦作为全球半导体领先厂商,其I2C类产品在汽车电子、工业控制等领域具备成熟可靠性验证,该型号延续了品牌在低功耗、高集成度外设上的技术优势,是系统I/O资源扩展的优选方案。

二、关键技术参数深度解析

2.1 通信与扩展能力

采用标准I2C接口,支持最高400kHz时钟频率,兼容高速I2C协议;通过硬件地址配置可实现16个设备级联,总I/O资源最多扩展至128路,满足多外设场景的连接需求。

2.2 I/O与驱动性能

8路双向I/O引脚,单引脚最大灌电流达25mA,无需额外驱动电路即可直接驱动LED、小型继电器等低功率负载,简化外围设计;I/O状态可通过I2C总线读写,支持输入/输出模式动态切换。

2.3 电源与功耗特性

工作电压覆盖2.3V~5.5V,适配主流MCU(STM32、ATmega等)供电;静态电流仅4.5uA,在电池供电场景(如物联网节点)下可有效延长设备续航。

2.4 环境可靠性

工作温度范围**-40℃~+85℃**,符合工业级标准,可适应户外、车载等复杂环境;内置复位功能,上电时自动初始化I/O为输入模式,避免初始状态不确定导致的误操作。

三、核心功能特性梳理

3.1 内置LED驱动

8路I/O内置LED驱动能力,结合25mA灌电流,可直接驱动常规LED(仅需串联小限流电阻),减少外部元件,降低BOM成本。

3.2 中断输出功能

具备专用中断引脚,当任意I/O状态变化时触发信号(如低电平),通知MCU无需轮询即可响应,显著降低系统功耗,提升事件响应速度。

3.3 级联与地址扩展

支持多设备级联,通过调整硬件地址引脚(A0-A2)可配置8种基础地址,结合软件扩展可实现16个设备并联,灵活适配复杂系统的I/O需求。

3.4 复位与初始化

内置上电复位电路,上电时自动将I/O配置为输入模式;支持外部复位输入,可与系统主复位同步,提升系统可靠性。

四、典型应用场景

4.1 工业控制

用于PLC的I/O扩展,实现数字量输入(传感器信号)和输出(继电器控制);宽温范围和高驱动能力适配工业现场 harsh 环境。

4.2 车载电子

适合车载中控面板的按键输入与LED显示控制,-40℃~+85℃符合车载环境要求,中断功能可快速响应驾驶员操作。

4.3 物联网终端

应用于电池供电的智能传感器节点(环境监测、智能家居),低静态电流延长电池寿命;I2C接口方便与MCU通信,内置LED实现状态指示。

4.4 消费电子

用于智能家电(洗衣机、空调)控制面板扩展,实现按键输入与LED显示,简化电路设计,降低成本。

五、封装与可靠性设计

采用16-TSSOP薄型小尺寸封装,体积小巧(4.4mm×3.0mm),适合小型化设备PCB布局;引脚间距0.65mm,焊接工艺成熟,可靠性高;恩智浦质量管控确保产品符合工业级标准,可长期稳定运行。

六、产品应用优势总结

PCA8574APW,118凭借高集成度(8I/O+LED驱动+中断+复位)、低功耗(4.5uA静态电流)、宽适配性(宽电压/宽温)和灵活扩展(16设备级联)等优势,成为系统I/O不足时的高效解决方案,可有效降低设计复杂度与成本,提升产品竞争力。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.