Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NXP Semiconductors 的 LPC804M101JHI33Y 是一款基于 ARM® Cortex®-M0+ 内核的高效单片微控制器(MCU)。Designed specifically for cost-sensitive and power-efficient applications, this microcontroller excels in a variety of embedded systems that require reliable performance and low power consumption.
LPC804M101JHI33Y 采用 32 位 ARM Cortex-M0+ 处理器,主频高达 15MHz,能够在低功耗环境下提供出色的计算能力。该 MCU 拥有 32KB 的闪存程序存储容量,能够存储复杂的程序代码,同时配备 4KB 的 RAM,为数据处理提供足够的空间。其设计非常适合空间有限的应用场合。
LPC804M101JHI33Y 在功能上具有多种连接能力,包括 I²C、SPI 和 UART/USART 等接口,确保与外部设备的良好通信。此外,该 MCU 还支持多种外设,如欠压检测/复位(POR)、脉冲宽度调制(PWM)、看门狗定时器(WDT),适用于对实时性和可靠性要求较高的应用。
在数据处理方面,LPC804M101JHI33Y 具备 12 位 A/D 转换器,能够处理多达 12 个模拟输入信号,同时具备 1 路 10 位的 D/A 转换器,满足从数字到模拟信号的转换需求。这些功能使其非常适合如传感器数据采集和控制系统等应用场景。
该 MCU 的供电电压范围为 1.71V 至 3.6V,支持多样化的供电解决方案,适合各种电池供电的应用。其工作温度范围为 -40°C 至 105°C,意味着 LPC804M101JHI33Y 可在极端环境下稳定运行,非常适合工业、汽车及其他需要温度适应性的应用。
LPC804M101JHI33Y 采用 32-VFQFN 裸露焊盘封装,尺寸为 5x5 mm,这种表面贴装型封装能有效减少PCB板面积,并提供良好的热管理性能。由于其紧凑的封装特性,这款 MCU 特别适用于现代的紧凑型设计和高集成度产品。
此款微控制器广泛应用于物联网(IoT)设备、消费电子、医疗设备、汽车电子等领域。无论是在智能家居、可穿戴设备,还是在工业自动化和控制系统中,LPC804M101JHI33Y 都能提供高效、稳定的性能表现。
总之,NXP 的 LPC804M101JHI33Y 是一款功能强大且灵活的 32 位单片机,具有出色的处理能力及丰富的外设接口,特备适合于低功耗和高效能的嵌入式应用。凭借其在温度范围、电压适应性和紧凑设计方面的优势,使其在当今快速发展的电气工程与电子设备领域扮演着重要的角色。无论是设计新产品或升级现有系统,LPC804M101JHI33Y 都将是值得考虑的优秀选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products