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TJA1145TKJ
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP TJA1145TKJ
- Type
- NXP
- Minimum package
- 6000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- TJA1145TKJ
- Electronic Component
- 1
- Package
- HVSON-14(3x4.5)
- Type
- CAN Transceiver
- Electronic Component
- CAN Transceiver
- Electronic Component
- 0.09g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- ESD; TXD;; Low Power; SPIInterface
- Electronic Component
- BM0257268283
- Operating Temperature
- 40℃~+150℃
- Operating Voltage
- 4.5V~5.5V
- Operating Current
- 65mA
- Data
- 2Mbps
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TJA1145TKJ 产品概述
一、产品概况
TJA1145TKJ 是恩智浦（NXP）推出的一款高性能 CAN 总线收发器，属于完全版（full-featured）收发器家族。其核心电气参数包括：高速数据传输支持最高 2 Mbps，工作电源 4.5 V～5.5 V，工作电流典型值 65 mA，静态待机电流仅 68 μA，工作温度范围宽（-40 ℃ ～ +150 ℃），封装为 HVSON-14（3.0 × 4.5 mm）。这些特性使其适合苛刻的汽车与工业环境。
二、主要特性
- 支持高速 CAN 通信（最高 2 Mbps），满足多数车辆域网与工业控制的速率需求。
- 宽电压工作范围（4.5 V～5.5 V），与典型 5 V 总线系统兼容。
- 低待机电流（68 μA），便于系统低功耗管理与节能设计。
- 宽温工作范围（-40 ℃～+150 ℃），适用于高温环境或车载高温近发动机舱等场景。
- HVSON-14 小封装，便于高密度 PCB 布局与自动化贴装。
三、封装与热管理
HVSON-14（3 × 4.5 mm）封装体积小，热阻相对较低，但在 65 mA 工作电流下（以 5 V 供电估算功耗约 325 mW）仍需注意 PCB 散热设计。建议在底层和焊盘区域使用足够铜箔、短热过孔与焊盘峰值散热路径，以保障长期可靠性并避免器件结温超限。
四、典型应用场景
- 汽车电子：车身控制模块（BCM）、车载网关、车载诊断、仪表与门控单元等。
- 工业控制：PLC 与现场总线节点、数据采集与远程监控设备。
- 商业车辆与特殊车辆的通信节点：CAN 总线扩展设备、数据记录器等。
五、设计注意要点
- 总线终端：在 CAN 总线上采用 120 Ω 终端电阻，两端分别终端以保证阻抗匹配。
- 电源去耦：靠近 VCC 引脚放置 0.1 μF（陶瓷）与 1 μF（钽或陶瓷）并联去耦电容，抑制瞬态噪声。
- EMC 与 ESD：保持 CAN_H/CAN_L 差分对布线对称，尽量缩短回流路径；在有强干扰环境下考虑额外 TVS 耐压保护。
- 散热与封装焊盘：在 PCB 设计中为底部散热焊盘与多孔过孔提供热通道，并遵循厂家推荐的焊盘拓扑。
- 功能验证：系统级测试中包含短路、开路、共模瞬态耐受与高低温稳定性验证以确保长期可靠运行。
六、规格摘要
- 品牌：NXP（恩智浦）
- 类型：CAN 收发器（完全版）
- 数据速率：最高 2 Mbps
- 工作电压：4.5 V ～ 5.5 V
- 工作电流：65 mA（典型）
- 静态电流：68 μA（待机）
- 工作温度：-40 ℃ ～ +150 ℃
- 封装：HVSON-14（3 × 4.5 mm）
如需进一步的引脚定义、详细电气特性曲线或参考电路图，我可以根据具体应用给出更精细的建议与布局参考。
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