WMSIC Electronic Components

SC16IS740IPW/Q900 SC16IS740IPW

ModelSC16IS740IPW/Q900
PackageTSSOP-16
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP SC16IS740IPW / Q900
Type
NXP
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
SC16IS740IPW/Q900
Electronic Component
1
Package
TSSOP-16
Electronic Component
Bus-to-UART Bridge
Electronic Component
0.28g
Electronic Component
1
FIFO
64Byte
Features
RS-485;;; Low Power; /; positions
Electronic Component
BM0265004407
Operating Temperature
40℃~+95℃
Operating Voltage
3.3V;2.5V
Interface Type
SPI;UART;I2C
Channel Count
1
Electronic Component
5Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SC16IS740IPW/Q900 产品概述

一、产品简介

SC16IS740IPW/Q900 是恩智浦(NXP)推出的一款单通道串口控制器,集成了 UART 功能并通过 I²C 或 SPI 总线与主控通信,封装为 16 引脚 TSSOP。器件面向需要在嵌入式系统中扩展串口、实现 RS-232/RS-485 接口控制或桥接多总线的应用场景,提供高性能的硬件 FIFO、灵活的流控与低功耗选项。

二、主要特性

  • 单路 UART 通道,支持最大串口速率 5 Mbps,满足高速通信需求。
  • 内部 FIFO 容量 64 字节,有效减少 MCU 轮询频率与中断次数。
  • 支持 I²C 与 SPI 双重主接口,便于与多种主控芯片连接。
  • 自动 RS‑485 方向控制(自动 DE 驱动),简化半双工网络的驱动逻辑。
  • 硬件流控(RTS/CTS)与软件流控(XON/XOFF)同时支持,增强可靠性。
  • 内部环回/自检模式,便于系统上线自检与调试。
  • 支持软复位与寄存器可编程配置,便于远程重置与参数调整。
  • 支持低功耗模式,适合电池供电及节能型应用。
  • 工作电压支持 3.3V 与 2.5V(具体选型请参考器件版本),工作温度范围 -40℃ ~ +95℃。
  • 封装:TSSOP-16(SC16IS740IPW/Q900)。

三、功能说明

  1. 串口性能:单通道 UART 支持标准帧结构与高达 5 Mbps 传输速率,结合 64 字节 FIFO 可应对突发数据流,降低主控中断负担。
  2. 总线接口:通过 I²C(典型地址映射)或 SPI(多模时序)与主控通讯,固件可根据系统需求在两种总线之间选择。
  3. RS‑485 支持:器件内置自动方向控制逻辑,发送时自动驱动 DE,结束发送后自动切换为接收,避免主控频繁操控 DE 引脚。
  4. 流控机制:RTS/CTS 硬件流控确保高负载下无丢包,XON/XOFF 软件流控可在资源受限时作为补充。
  5. 诊断与自检:内部环回模式允许在不外接物理线路的条件下验证收发链路;软复位可快速恢复寄存器到默认状态。
  6. 低功耗特性:支持待机/休眠模式,可在空闲时降低功耗,适配电源受限场景。

四、典型应用场景

  • 工业现场总线网关、RS‑485 多点通讯节点。
  • 工控与仪器仪表中的串口扩展模块。
  • 智能楼宇、能源管理系统中的串口数据采集与转发。
  • 需要将 UART 数据桥接到 I²C/SPI 总线的嵌入式子系统。
  • 需自检/远程复位功能的远端设备管理单元。

五、封装与电气概要

  • 封装:TSSOP-16,适合体积受限的工业级板级设计。
  • 电源:支持 3.3V 与 2.5V 操作(请根据具体器件等级与板上其他器件确定电源规划)。
  • 温度:工业级 -40℃ 至 +95℃。
  • FIFO:64 Byte,显著提高数据缓冲能力以减少 MCU 负载。

六、设计与选型建议

  • 与物理层器件协同:SC16IS740 提供 UART 核心功能,但 RS‑232/RS‑485 的电平转换需外加专用收发器(如 RS‑485 收发器、RS‑232 驱动器),并在布局时考虑差分线对与阻抗匹配。
  • 电源去耦:在 VCC 近旁放置 0.1µF 和 1µF 去耦电容,保证电源稳定,避免高速 SPI 时序畸变。
  • 总线拉/上拉:I²C 总线请按系统需要配置合适的上拉电阻;SPI 模式下注意 CS、SCLK 的空闲电平与时序。
  • 接地与屏蔽:工业环境下注意接地与屏蔽,减少 EMI 对高波特率通信的影响。
  • 软件驱动:利用器件提供的寄存器映射实现 FIFO 管控、流控与自动 DE 配置,建议实现中断驱动结合 DMA(如主控支持)以获得最佳效率。

总结:SC16IS740IPW/Q900 是一款功能全面、适配灵活的单通道 UART 扩展器件,适合工业级与嵌入式系统中对串口扩展、RS‑485 自动控制和低功耗设计有较高要求的场合。选型时请结合系统电源、电平与物理收发器共同设计,以发挥器件最佳性能。

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