Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MIMXRT1052CVL5B是由恩智浦半导体公司(NXP USA Inc.)生产的一款高性能单片机(MCU),属于RT1050系列。该产品采用先进的ARM® Cortex®-M7核心架构,具有高达528MHz的处理速度,能满足各类高复杂度应用的需求。其核心设计旨在优化执行效率和降低功耗,非常适合实时处理应用,比如工业控制、物联网(IoT)及智能家居设备。
MIMXRT1052CVL5B采用32位内核架构,提供出色的计算能力,适合运行要求较高的应用程序。该单片机的工作电压范围为3.0V至3.6V,确保在多种环境条件下的稳定性。此外,设备提供512KB的RAM,使其能够高效处理数据并支持各种复杂的实时计算任务。
MIMXRT1052CVL5B支持广泛的连接能力,即便在数据密集型或高速应用场合,也能保持流畅的通信体验。其支持的接口包括但不限于:
该设备整合丰富的外设功能,子系统设计包括:
MIMXRT1052CVL5B具有宽广的工作温度范围(-40°C至105°C),使其能够在严苛的环境条件下运行,适合于工业、军事等领域的应用。
本产品采用196-LFBGA的表面贴装型封装,具有较小的体积和良好的电气性能。196-MAPBGA封装设计为10x10mm,使得其能够适用于空间受限的应用场景。此外,具有127个I/O口,进一步扩展了其与外部设备或传感器的连接能力。
MIMXRT1052CVL5B广泛应用于多种领域,包括:
综上所述,MIMXRT1052CVL5B是一款高度集成的高性能单片机,具备强大的处理能力及丰富的外设功能,适合多种复杂应用场景。在现代数字化和网络化迅速发展的背景下,其优越的性能和灵活的连接能力无疑为开发者和企业提供了强大的解决方案。无论是在工业应用、智能家居还是物联网技术领域,MIMXRT1052CVL5B都展现出其独特的价值,为相关产品的升级与创新奠定了基础。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products