Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
NTS0102TL-Q100H NTS0102TL
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- NXP NTS0102TL-Q100H
- Type
- NXP
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- NTS0102TL-Q100H
- Electronic Component
- 1
- Package
- SOT-1052
- Electronic Component
- Converter / Level positions
- Electronic Component
- 1g
- Electronic Component
- NXP USA Inc.
- Electronic Component
- 1
- Electronic Component
- 1
- Electronic Component
- BM0234453028
- Type
- Surface Mount
- Operating Temperature
- 40°C ~ 125°C（TA）
- Data
- 50Mbps
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NTS0102TL-Q100H 产品概述
一、产品简介
NTS0102TL-Q100H 是恩智浦（NXP USA Inc.）推出的一款双向电压电平转换器，单芯片包含 1 个电路、2 个通道，适用于不同电压域之间的信号接口。器件为在售产品，采用卷带（TR）包装，适合贴片生产线使用。典型封装为 8 引脚裸露焊盘 XFDFN / XSON（2×3），供应商封装标识 SOT-1052。
二、主要特性
- 通道类型：双向，支持双通道信号互通。
- 电源电压范围：VCCA 1.65 V ～ 3.6 V，VCCB 2.3 V ～ 5.5 V，覆盖常见低压与TTL/CMOS电平域。
- 数据速率：最高可达 50 Mbps，适合多数串行总线和GPIO速度需求。
- 输出类型：支持开路漏极、推挽式和三态输出模式，兼容多种上拉/驱动方案。
- 工作温度：工业级 -40°C ～ 125°C（TA），适合宽温环境应用。
- 封装与安装：表面贴装（SMD），8-XFDFN/8-XSON（2×3）带裸露焊盘，便于热管理与底层接地。
三、典型应用场景
- 多电压系统中 MCU、FPGA 与外设的接口电平桥接；
- I2C、UART、SPI 或通用 GPIO 电平匹配（根据总线特性选择开漏或推挽配置）；
- 便携式设备、消费电子、工业控制中不同电源域之间的信号互通；
- 汽车电子与宽温工作环境下的低速至中速串行通信（注意在汽车级应用时参照器件认证要求）。
四、使用建议与注意事项
- 去耦：在 VCCA 与 VCCB 供电引脚附近各放置典型 0.1 µF 去耦电容，靠近器件焊盘布局以提高电源稳定性。
- 裸露焊盘：器件底部裸露焊盘应焊接至 PCB 对应焊盘以提升热散与接地性能，遵循厂商推荐的焊盘尺寸和回流工艺。
- 上拉/下拉：若使用开路漏极模式或兼容 I2C 总线，请在对应侧加合适阻值的上拉电阻；推挽或三态模式时，根据负载与速度选择阻值以平衡上升下降时间。
- 信号完整性：在接近 50 Mbps 工作点时注意走线阻抗、串扰与终端匹配，必要时加入适当的滤波或终端元件。
- 温度与可靠性：器件额定工作温度为 -40°C 至 125°C，需在设计时考虑热源与散热途径，确保在高温功耗条件下可靠工作。
五、采购与封装信息
- 制造商：NXP USA Inc.（恩智浦）
- 封装形式：8 引脚 XFDFN / XSON（2×3），供应商封装 SOT-1052，带裸露焊盘（Exposed Pad）。
- 包装：卷带（TR），适合贴片生产线自动化装配。
- 器件状态：在售，可按量产需求通过授权分销商或恩智浦渠道订购。
此器件面向需要在不同电压域间可靠传输低至中速数字信号的应用场景，结合其宽电压范围与工业级温度规格，是进行电平兼容设计时的常用方案。购买与最终设计前，建议参考恩智浦最新数据手册获取引脚对应、典型电路、封装尺寸与推荐焊盘设计等详细信息。
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