WMSIC Electronic Components

MPX5500DP

ModelMPX5500DP
PackageSIP-6-1.22mm
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP MPX5500DP
Type
NXP
Unit
Electronic Component
Minimum package
20 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
MPX5500DP
Electronic Component
1
Package
SIP-6-1.22mm
Electronic Component
Electronic Component
Electronic Component
Pressure Sensor
Electronic Component
5.25g
Electronic Component
1
Features
Electronic Component
Electronic Component
0Kpa~5bar
Electronic Component
1ms
Electronic Component
BM0252945904
Operating Temperature
40℃~+125℃
Operating Voltage
5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MPX5500DP 产品概述

一、产品简介

MPX5500DP 为 NXP(恩智浦)出品的硅基压阻式压力传感器芯片(IC SENSOR PRESS GAUGE),封装为 SIP-6(针距 1.22 mm),适合通过孔安装与系统级集成。器件标称量程可覆盖近 75 PSI 级别(约 5.17 bar),在常见规格中也常以 0–5 bar 作为标称范围给出,能够满足中高压测量场景的需求。器件为测量气体或非腐蚀性介质的压力检测提供稳定的模拟输出,便于与单片机/ADC 直接配合使用。

二、主要技术参数

  • 压力范围:0 kPa ~ 5 bar(近似 75 PSI 级别)
  • 工作电压:5 V(标称,典型 5 V 供电)
  • 工作温度:-40 ℃ ~ +125 ℃
  • 响应时间:约 1 ms(快速响应)
  • 封装:SIP-6(1.22 mm 针距)
  • 品牌:NXP(恩智浦)

三、产品特点与优势

  • 快速响应(≈1 ms),适用于动态压力监测与控制回路。
  • 宽温度工作范围,适应严苛环境和工业级应用。
  • 与 5 V 系统直接兼容,易于与 MCU/ADC 整合,实现比例(ratiometric)测量。
  • SIP-6 通用封装,便于 PCB 布局与批量生产装配。
  • 可靠性高、长期漂移小,适合连续运行的监测系统。

四、典型应用场景

  • 汽车电子:轮胎压力、制动与悬架系统监测(需按车辆标准验证)。
  • 工业控制:气动系统、压缩机与泵的压力反馈。
  • HVAC 与家电:风压、气流和压力安全保护。
  • 医疗设备:非侵入性气体流量/压差检测(需按医疗认证要求评估)。
  • 工程测试与数据采集系统:快速响应的实验与监测平台。

五、接口与设计建议

  • 建议在传感器电源端并联稳压与去耦电容,减少电源噪声对模拟输出的影响。
  • 输出端可加小阻值 RC 滤波器以抑制高频干扰,但应兼顾响应时间要求。
  • 与 ADC 连接时采用与供电同源的参考(ratiometric 测量)可降低温漂影响。
  • 布局时将信号线短而独立走线,避免与高电流或开关噪声线并行。
  • 设计时注意超压保护与机械防护,避免长期超过量程导致漂移或损坏。

六、使用注意与可靠性提示

  • 适用介质通常为干净、非腐蚀性气体;若接触液体或腐蚀性介质,应确认材料兼容性或采用隔离膜片。
  • 避免长期过压或频繁冲击超出额定范围,以防漂移或失效。
  • 出厂前建议进行一次系统级校准,运行环境温度剧烈变化时可考虑进行温度补偿。
  • 存储与运输避免强烈机械振动与静电损伤,必要时加装防静电保护措施。

七、小结

MPX5500DP 是一款面向工业与汽车等领域的高可靠性压阻式压力传感器芯片,具有快速响应、宽温工作与与 5 V 系统良好兼容的优点。通过合理的电路接口设计与机械安装,可在多种压力监测与控制场景中提供稳定、可重复的测量结果。如需在具体系统中使用,建议参考恩智浦官方器件手册进行详细的电气与机械参数校核与匹配。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.