WMSIC Electronic Components

TEA1716T/2,518 TEA1716T

ModelTEA1716T/2,518
PackageSO-24-300mil
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
NXP TEA1716T / 2, 518
Type
NXP
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
TEA1716T/2,518
Electronic Component
1
Package
SO-24-300mil
Type
PFCController+AC-DCController
Electronic Component
PFC Controller
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0252969441
Operating Voltage
14.1V~21V
Current(IOH)
600mA
Current(IOL)
1.2A
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TEA1716T/2,518 产品概述

一、产品简介

TEA1716T/2,518 为恩智浦(NXP)推出的集成型PFC控制器与AC‑DC控制器,工作于间歇导通模式(DCM)。器件适用于要求高能效、低待机功耗与紧凑磁性元件尺寸的离线电源设计,常见于消费类电源适配器、LED驱动及工业辅助电源等场景。

二、主要参数

  • 类型:PFC 控制器 + AC‑DC 控制器(DCM)
  • 工作电压:14.1 V ~ 21 V
  • 开关频率:500 kHz
  • 拉电流 (IOH):600 mA
  • 灌电流 (IOL):1.2 A
  • 工作电流:3.2 mA
  • 静态电流 (Iq):220 μA
  • 工作温度:-40 ℃ ~ +150 ℃
  • 封装:SO‑24 300 mil(24 引脚常见封装)
  • 品牌:NXP(恩智浦)

三、设计优势与要点

  1. DCM 工作模式:有助于简化控制策略、降低环路补偿复杂度并在轻载下实现较高效率,同时有利于减小磁性元件体积。
  2. 高开关频率(500 kHz):允许使用更小的电感与变压器,但需兼顾开关损耗与散热设计。
  3. 强驱动能力:600 mA/1.2 A 的拉/灌电流利于驱动功率开关管,实现快速开关及良好开关波形。
  4. 低静态电流与低工作电流:有利于系统待机功耗优化,符合能效规范。
  5. 宽温度范围:适用于恶劣环境与工业级应用,但需注意封装散热和过温保护设计。

四、典型应用

  • 开关电源前级 PFC 与后段 AC‑DC 一体化设计
  • LED 照明驱动电源(要求高效率与紧凑尺寸)
  • 手机/平板/笔电等适配器与通用充电器
  • 工业与家电辅助电源

五、封装与选型建议

TEA1716T/2,518 提供 SO‑24(300 mil)封装,便于 PCB 布局与热管理。选型时应结合目标输出功率、整机热设计、EMI 要求及外部功率器件(MOSFET、二极管、电感、电容)的额定能力,验证在整个工作温度与负载范围内的稳定性与可靠性。

总结:TEA1716T/2,518 以其集成化功能、DCM 工作模式与较强的驱动能力,适合对体积、效率与待机功耗有较高要求的离线电源应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.