WMSIC Electronic Components

MPXHZ6115A6T1

ModelMPXHZ6115A6T1
PackageSOIC-8-300mil
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP MPXHZ6115A6T1
Type
NXP
Unit
Electronic Component
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
MPXHZ6115A6T1
Electronic Component
1
Package
SOIC-8-300mil
Electronic Component
Electronic Component
Electronic Component
Pressure Sensor
Electronic Component
0.761g
Electronic Component
1
Features
Integrated Signal Amplifier
Electronic Component
15Kpa~1.15bar
Electronic Component
1ms
Electronic Component
BM0231142931
Operating Temperature
40℃~+125℃
Operating Voltage
4.75V~5.25V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MPXHZ6115A6T1 产品概述

一、产品概述

MPXHZ6115A6T1 是恩智浦(NXP)推出的一款硅压阻式绝对压力传感器,封装为 SOIC-8-300mil。器件内部为真空参考(绝对型),带有信号调理,适合直接输出可由模数转换器采集的模拟电压信号。典型工作电压 4.75V ~ 5.25V,工作温度范围宽 (-40℃ ~ +125℃),响应时间快(约 1 ms),测量范围覆盖 15 kPa ~ 1.15 bar(绝对压)。

二、主要规格

  • 压力类型:绝对压力(内部真空参考)
  • 压力范围:15 kPa ~ 1.15 bar (绝对)
  • 工作电压:4.75 V ~ 5.25 V(典型 5 V)
  • 工作温度:-40 ℃ ~ +125 ℃
  • 响应时间:约 1 ms
  • 封装:SOIC-8-300mil(便于 PCB 表面贴装与焊接)
  • 品牌:NXP(恩智浦)

三、关键特性与优势

  • 精度与稳定性:集成温度补偿与信号调理,温漂和长期漂移受控,适合对稳定性有较高要求的测量场景。
  • 快速响应:1 ms 的响应时间可满足动态压力变化的实时检测需求。
  • 宽温工作:-40 ℃ 到 +125 ℃ 的工业级温度范围,适配恶劣环境。
  • 易于系统集成:SOIC-8 标准封装便于自动化贴装与常规 PCB 设计,无需外部参考源。
  • 低功耗与单电源工作:标准 5 V 供电,便于与 MCU/ADC 系统配合。

四、典型应用场景

  • 工业过程控制与监测(密封系统、真空系统)
  • 汽车电子中的气压监测(非安全关键系统)
  • 医疗设备气压/呼吸检测(需按医疗法规验证)
  • 环境与气象监测站、实验室设备压力测量
  • 气体流量与微流控系统的反馈控制

五、接口与使用建议

  • 供电与旁路:在 VCC 与 GND 之间放置 0.1 μF 陶瓷旁路电容,并加 4.7 μF 以上电解或陶瓷电容以稳定供电。
  • 输出采集:建议通过缓冲运放或直接送入高精度 ADC(注意输入阻抗与采样网络),在 ADC 采样前可并联小阻值和/或 RC 低通滤波以抑制噪声。
  • 布线与接地:模拟地应靠近器件接地,避免长距数字地环路干扰;供电线短且粗,减少压降与干扰。
  • ESD 与过压保护:在输入/输出引脚旁可加 TVS 或钳位二极管以防静电冲击和瞬态过压。

六、安装、校准与可靠性注意事项

  • 机械应力避免:封装与焊盘设计应避免在器件焊接或 PCB 弯曲时对芯片产生应力。
  • 环境密封:虽然为绝对型(内部真空参考),但仍应避免腐蚀性气体、液体直接接触封装,以免影响长期稳定性。
  • 校准建议:出厂后建议在目标温度与压力点进行一次系统级校准,以修正系统级误差(ADC 参考、电源偏差等)。定期复校可控制长期漂移。
  • 可靠性:遵循制造商焊接与回流曲线,避免超温或过长回流,以保证封装与内部封装完整性。

备注:在具体设计与关键指标(精度、灵敏度、输出范围、供电纹波容忍度等)方面,建议参照恩智浦官方数据手册与应用说明书,以获取完整电气特性与典型曲线。MPXHZ6115A6T1 适用于需要高稳定性、快速响应与宽温度范围的绝对压力测量场合。

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