WMSIC Electronic Components

MK22FX512AVLQ12

ModelMK22FX512AVLQ12
PackageLQFP-144(20x20)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP MK22FX512AVLQ12
Type
NXP
Unit
Electronic Component
Minimum package
60 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
MK22FX512AVLQ12
Electronic Component
1
Package
LQFP-144(20x20)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
2.967g
CPU
32 Bit
CPU
ARM Cortex-M4
I / O
100
RAM
64KB
Electronic Component
1
Features
(BOR / LVD / LVR / LVI);; positions(POR); Built-in General Purpose; Gate; CRC
Electronic Component
BM0264843833
Operating Temperature
40℃~+105℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MK22FX512AVLQ12 单片机产品概述

MK22FX512AVLQ12是恩智浦(NXP)Kinetis K22系列下的一款高性能32位单片机,针对工业控制、物联网终端等场景优化了存储、接口与可靠性,具备高性价比与宽环境适应性,是嵌入式系统开发的主流选择之一。

一、核心性能与架构

该器件搭载ARM Cortex-M4内核,支持最高120MHz主频运行,具备32位数据处理能力,同时集成DSP指令集与单精度浮点运算单元(FPU),可高效处理电机控制、信号滤波等复杂算法。内核内置振荡器,无需外部晶振即可实现稳定时钟输出,简化外围电路设计。

工作电压范围为1.71V~3.6V,覆盖低功耗(电池供电)与常规工业电源场景;工作温度达**-40℃~+105℃**,符合工业级器件标准,可适应严苛环境温度变化。

二、存储资源配置

MK22FX512AVLQ12的存储资源充足,满足多数嵌入式应用需求:

  • 程序存储:512KB FLASH,支持在线编程(ISP)与擦除,可固化带图形界面、多任务调度的复杂程序;
  • 数据存储:64KB SRAM,分为代码区与数据区,用于运行时变量、堆栈及临时数据存储,配合Cortex-M4的Cache机制提升访问效率。

三、接口与I/O能力

采用144-LQFP封装(20×20mm),共提供100个通用I/O引脚,集成丰富外设接口:

  • 通信接口:多组UART、SPI、I2C,以及CAN 2.0A/B总线,支持工业现场通信;
  • 模拟接口:16通道16位SAR ADC,转换速率1MHz,适合传感器数据采集;
  • 控制接口:多通道PWM模块,实现电机调速、LED调光等控制;
  • 可靠性外设:看门狗定时器(WDT)、实时时钟(RTC),提升系统稳定性与时间精度。

四、封装与工作环境

144-LQFP为表面贴装封装,引脚间距0.5mm,既保证高密度集成,又便于PCB设计与焊接;尺寸20×20mm,适合紧凑产品空间。

宽电压(1.71V3.6V)支持锂电池、5V稳压电源等多种供电方式;-40℃+105℃温度范围覆盖户外、车间等工业场景。

五、典型应用场景

该器件性能与接口特性适配以下场景:

  1. 工业控制:小型PLC、电机驱动控制器、传感器节点;
  2. 物联网终端:智能家居网关、工业物联网数据采集器;
  3. 消费电子:高端家电控制器、智能穿戴设备(低功耗模式);
  4. 智能仪器:手持测试仪器、小型医疗监护设备;
  5. 汽车电子(准工业级):车载辅助系统、车身控制模块。

总结:MK22FX512AVLQ12以Cortex-M4内核为核心,搭配充足存储、丰富接口与工业级可靠性,是平衡性能与成本的理想选择,适合对运算能力、存储容量与环境适应性有要求的嵌入式应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.