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TFA9879HN/N1,157 TFA9879HN
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP TFA9879HN / N1, 157
- Type
- NXP
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- TFA9879HN/N1,157
- Electronic Component
- 1
- Package
- HVQFN-24-EP(4x4)
- Electronic Component
- 92%
- Electronic Component
- Audio Power Amplifier
- Electronic Component
- 9.133g
- Electronic Component
- 1
- Power Amplifier Type
- D Power Amplifier
- Features
- Filter;; / Switch; /; Integrated PLL; Built-in Audio
- Electronic Component
- BM0248788253
- Operating Voltage
- 2.5V~5.5V
- Output Power
- 2.75W×1@4Ω
- Speaker Channel Count
- Electronic Component
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TFA9879HN/N1,157 产品概述
一、概述
TFA9879HN/N1,157 是恩智浦（NXP）推出的一款单声道 D 类功率放大器芯片，采用 HVQFN-24 (4×4 mm) 封装，面向便携式音频终端与低功耗扬声器驱动应用。芯片在 4Ω 负载下可提供最高 2.75W 输出，工作电压范围宽（2.5V～5.5V），在典型工作点下效率高达 92%，适合电池供电和空间受限的设计。
二、主要特性
- D 类拓扑，开关式输出，能效高、功耗低。
- 单声道输出：2.75W × 1（4Ω）。
- 宽工作电压：2.5V ～ 5.5V，支持常见锂电与多节电池系统。
- 封装：HVQFN-24-EP (4×4 mm)，利于表面贴装和批量生产。
- 典型效率：可达 92%，减少热设计压力。
三、电气与性能要点
- 输出功率：在 THD 指定条件下实现 2.75W（4Ω）。
- 总谐波失真（THD）、信噪比和频响需参考厂家数据手册以满足具体音质要求。
- 低静态电流和待机模式有利于延长电池寿命。
- 对输出滤波元件（如布线、电感、RC 滤波）要求与 D 类特性相关，需按手册推荐配置。
四、封装与散热
HVQFN-24 带有暴露焊盘（EP），4×4 mm 小尺寸便于提升 PCB 密度。建议：
- 暴露焊盘与多层 PCB 的 GND 平面通过热孔过孔相连以提升散热。
- 输出端与电源旁路电容尽量靠近器件布局，减少寄生并抑制 EMI。
五、典型应用
- 便携蓝牙音箱与随身音响。
- 手机或平板的辅助扬声器驱动。
- 智能家居终端与物联网带音频功能设备。
- 电池供电的便携设备需优先考虑其高效率优势。
六、设计与选型注意事项
- 确认系统供电范围与启动顺序，避免超压或反向连接。
- EMI 管理：D 类输出开关频率和输出滤波需要配合磁珠、共模/差模电感与布局优化。
- 热设计：在高输出功率持续工作时做好散热和保护。
- PCB 布局应遵循去耦、电源回流和地平面最短路径原则。
七、结论与建议
TFA9879HN/N1,157 以其高效率、小体积与宽电压范围，适合对功率、续航和空间有较高要求的单声道音频应用。建议在开发初期参考恩智浦完整的器件手册与参考设计，按照推荐的外围元件和 PCB 布局实施，以达到最佳性能和可靠性。
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