Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TJA1044GTKZ
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- NXP TJA1044GTKZ
- Type
- NXP
- Minimum package
- 6000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- TJA1044GTKZ
- Electronic Component
- 1
- Package
- 8-HVSON（3x3）
- Electronic Component
- CAN Transceiver
- Electronic Component
- 0.178g
- Electronic Component
- 1
- Features
- Integrated Level positions; ESD; TXD;; Low Power
- Electronic Component
- BM0262575771
- Operating Voltage
- 4.75V~5.25V
- Electronic Component
- Electronic Component
- Electronic Component
- 6000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TJA1044GTKZ 产品概述
一、产品简介
TJA1044GTKZ 是恩智浦（NXP）推出的一款车用单通道 CAN 总线半双工收发器，采用 8 引脚 HVSON（3x3 mm）封装。器件面向车载高速 CAN 网络物理层，提供差分发送/接收功能并集成多种保护与低功耗管理特性，适合车载控制域网、车身电子与车载诊断等场景。工作电压规格为 4.75V ~ 5.25V，兼容典型 5V 车载电子系统供电要求。
二、主要特性
- 支持高速 CAN 通信（符合 CAN 总线物理层要求，典型可达 1 Mbit/s）；差分收发，保持总线的显性/隐性状态检测能力。
- 集成电气保护：常见的短路、过压/反向保护与热关断机制，增强系统健壮性与故障隔离能力。
- 低功耗工作模式：具备待机/唤醒等低功耗管理接口（通过控制引脚实现），便于系统节能与唤醒策略实现。
- 总线容错与失效安全：在总线开路、短接到电源或地等异常情况下维持定义的失效安全电平，便于上层控制器可靠检测故障。
- 工业/车用级设计，适应汽车环境下的温度与电磁兼容要求。
三、电气与封装信息
- 工作电压：4.75V ~ 5.25V（符合典型 5V 供电）。
- 封装：8-HVSON（3x3 mm），小封装适合空间受限的车载控制模块。
- 引脚功能：通常包括 VCC、GND、TXD（驱动器输入）、RXD（接收器输出）、CAN_H、CAN_L 以及控制/监测引脚（如待机/唤醒/故障指示）。（具体引脚定义请参阅原厂数据手册）
四、典型应用场景
- 车身电子控制单元（BCM）、车门控制、座椅与车灯控制模块等车内子系统通信。
- 动力总成与底盘控制系统的局部网络接口节点。
- 车载诊断与车联网网关的物理层收发器。
- 其他需要稳健 CAN 物理层连接的嵌入式系统。
五、设计与使用建议
- PCB 布局上，应将 CAN_H/CAN_L 区域做差分走线并靠近收发器布局，避免环路与大面积铜皮引入干扰。
- 在收发器输入端建议并联 TVS 和差分共模扼流圈以提高防护与抑制共模干扰；总线末端遵循标准放置 120 Ω 终端电阻。
- 充分考虑去耦电容与电源滤波，靠近 VCC 引脚放置 0.1 μF 陶瓷电容以保证瞬态响应。
- 在量产前参考原厂推荐的故障与过压条件验证（如短路、负载、热关断等），确保系统在异常工况下的可靠性。
六、合规与资料
TJA1044 系列为面向汽车应用的收发器，常见应用需参考 NXP 的原厂数据手册来确认温度等级、封装管脚以及详细的电气参数和推荐使用电路。建议在设计前下载并阅读最新数据手册与应用说明，以确保满足系统级的功能与可靠性要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
