WMSIC Electronic Components

FXLS90322AESR2

ModelFXLS90322AESR2
PackageHLQFN-16(4x4)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP FXLS90322AESR2
Type
NXP
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
FXLS90322AESR2
Electronic Component
1
Package
HLQFN-16(4x4)
Electronic Component
IMU Sensor / Gyroscope
Electronic Component
1g
Electronic Component
1
Electronic Component
BM0258741638
Operating Temperature
40℃~+125℃
Operating Voltage
3.135V~5.25V
Interface Type
I2C;SPI
Output
12bit
Sensor Type
Electronic Component
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FXLS90322AESR2 产品概述

一、概述

FXLS90322AESR2 是恩智浦(NXP)面向汽车安全领域的 XY 双轴中等量程惯性传感器,专为安全气囊触发与碰撞检测等高冲击应用设计。器件采用 HLQFN-16 (4×4 mm) 封装,工作温度范围宽 (-40℃ 至 +125℃),适应汽车级环境要求。

二、主要参数与特性

  • 传感器类型:双轴加速度计(X、Y)。
  • 量程(最大):±500 g(medium-g,适用于碰撞事件捕获)。
  • 输出分辨率:12 bit(12 位输出,4096 步)。按 ±500 g 量程估算,量化步距约 0.244 g/LSB(近似值,具体线性与偏移请参照数据手册)。
  • 接口类型:I2C 与 SPI(双接口,便于不同 MCU 集成)。
  • 工作电压:3.135 V ~ 5.25 V(宽电压兼容常见 3.3 V 与 5 V 系统)。
  • 工作温度:-40℃ ~ +125℃(满足汽车环境)。
  • 封装:HLQFN-16(4×4 mm),便于 PCB 紧凑布局与自动化贴装。

三、典型应用场景

  • 汽车安全气囊与碰撞检测系统(air bag / crash sensing)。
  • 被动安全事件记录、侧向碰撞检测与安全控制单元触发逻辑。
  • 工业冲击监测、振动分析等需要短时高冲击响应的场合。

四、设计与布局建议

  • 电源去耦:在 VDD 近端放置 0.1 μF 陶瓷去耦电容,必要时并联 1 μF 以抑制低频噪声。
  • I2C / SPI 接口:I2C 侧使用上拉电阻到 VDD;SPI 需关注时钟极性/相位配置与片选使能。若 MCU 电压低于传感器最小电压,需做电平转换。
  • 走线与阻抗:信号线缩短并远离高频开关电源,SDA/SCL 或 MOSI/MISO/CLK 走线尽量并行并加终端/滤波以降低干扰。
  • 机械安装:传感器应靠近车体参考点或碰撞测量点安装,保证测量轴与车辆坐标系对齐;避免在应力集中或高振幅共振区域粘贴。

五、可靠性与环境适配

  • 温度与冲击:器件额定温度与高量程使其适合汽车碰撞环境,但应避免超过 ±500 g 的短时冲击峰值或长期机械残伤。
  • ESD 与防护:在汽车系统中常见静电和浪涌,设计时须在外部添加保护元件(如瞬态抑制)并在 PCB 布局上考虑接地与屏蔽。

六、快速选型与实施要点

  • 若系统需要同时支持 I2C 和 SPI,则 FXLS90322 提供灵活接口选择;若 MCU 电源在 3.135 V~5.25 V 范围内,可直接对接。
  • 依据 12-bit 分辨率与 ±500 g 量程评估是否满足触发阈值与分辨率需求;如需更高分辨率或低速测量精度,请比对其他量程/分辨率器件。
  • 最终设计前请参考恩智浦官方数据手册获取完整寄存器映射、电气特性、滤波/带宽设置及推荐 PCB 布局图,完成软件阈值与去偏校准以确保可靠触发与重复性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.