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LPC1313FBD48,151 LPC1313FBD48
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- NXP LPC1313FBD48, 151
- Type
- NXP
- Unit
- Electronic Component
- Minimum package
- 250 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- LPC1313FBD48,151
- Electronic Component
- 1
- Package
- 48-LQFP
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 0.001g
- CPU
- 32 Bit
- CPU
- ARM Cortex-M3
- I / O
- 42
- RAM
- 8KB
- Electronic Component
- 1
- ADC
- 10bit
- Electronic Component
- BM0262715418
- Operating Temperature
- 40℃~+85℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LPC1313FBD48,151 产品概述
一、简介
LPC1313FBD48,151 是恩智浦（NXP）基于 ARM Cortex‑M3 内核的高性价比单片机，面向嵌入式控制与感知应用。器件以 32 位 Cortex‑M3 为核心，最高主频可达 72MHz，结合丰富的外设与低功耗特性，适合工业控制、楼宇设备、消费电子与物联网终端等场景。
二、核心与性能
该器件采用 ARM Cortex‑M3 内核，32Bit 结构提供良好的计算与中断响应能力，72MHz 的最大主频在多数实时与控制任务中表现稳定。内置硬件乘法器与体系结构优化对控制算法、通信协议栈及信号处理均有帮助。
三、存储资源
LPC1313 提供 32KB 闪存（FLASH）用于程序存储，非易失性存储便于固件更新与产品维护。片上 SRAM 容量为 8KB，能满足常见控制程序、缓冲区与实时数据处理需求。存储组合适用于中等复杂度固件与嵌入式协议实现。
四、I/O 与外设
器件提供多达 42 个通用 I/O 引脚，支持灵活的外设复用配置，便于驱动传感器、继电器、显示模块和通信接口。内置振荡器降低外部晶振依赖，简化硬件设计。常见接口可通过引脚复用实现，适合紧凑型电路板布局。
五、模数转换与模拟能力
片内 10bit ADC 为器件提供基础的模拟信号采集能力，可直接连接温度传感器、电压检测或其他线性传感元件，满足常见测量与控制需求。结合低速采样与适当滤波，可用于闭环控制与能耗监测。
六、电源与环境特性
工作电压范围为 2.0V 至 3.6V，覆盖常见单节锂电池及 3.3V 系统。器件可在 −40℃ 至 +85℃ 工业级温度范围稳定运行，适应恶劣工业与户外环境。支持多种功耗管理模式，利于电池供电设计和待机省电策略。
七、封装与开发支撑
LQFP‑48（7x7mm）封装便于手工焊接与小批量制造，兼顾引脚数与尺寸要求。作为 NXP LPC 系列成员，可使用主流 ARM 工具链（如 Keil、IAR、GCC）进行开发，配合供应商示例代码与驱动库，缩短开发周期。
八、典型应用
- 工业传感与控制单元（PLC 辅助模块、逻辑控制）
- 智能家居与楼宇自动化（温控、照明控制）
- 便携式测量仪表与数据采集终端
- 低功耗物联网节点与网关中控单元
总结：LPC1313FBD48,151 以其稳健的 ARM Cortex‑M3 性能、适用的存储配置、充足的 I/O 与工业级电气特性，成为面向中小型嵌入式控制系统的可靠选择。设计时可根据外设复用、ADC 需求与功耗预算调整硬件布局与固件策略，以获得最佳系统表现。
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