WMSIC Electronic Components

S9KEAZ64AMLH

ModelS9KEAZ64AMLH
PackageLQFP-64(10x10)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP S9KEAZ64AMLH
Type
NXP
Minimum package
800 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
S9KEAZ64AMLH
Electronic Component
1
Package
LQFP-64(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.383g
CPU
32 Bit
CPU
ARM Cortex-M0+
I / O
57
RAM
8KB
Electronic Component
1
ADC
12bit
Electronic Component
BM0247690958
Operating Temperature
40℃~+125℃
Operating Voltage
2.7V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S9KEAZ64AMLH 产品概述

产品简介
S9KEAZ64AMLH 是恩智浦(NXP)推出的一款高性能、低功耗的32位单片机(MCU),基于ARM® Cortex®-M0+内核设计。该产品专为嵌入式应用而开发,适用于工业控制、汽车电子、消费电子和物联网(IoT)等领域。其高集成度、丰富的连接能力和灵活的外设配置,使其成为中小型嵌入式系统的理想选择。

核心特性

  1. 处理器与性能

    • 核心处理器:ARM® Cortex®-M0+,32位架构,运行频率高达48MHz,提供高效的运算能力和低功耗性能。
    • 内核优势:Cortex-M0+内核以其低功耗和高效率著称,适合对功耗敏感的应用场景。
  2. 存储资源

    • 程序存储器:64KB闪存,支持多次擦写,便于固件升级和调试。
    • RAM容量:8KB SRAM,为实时数据处理和变量存储提供充足空间。
  3. 连接能力

    • 支持多种通信接口:包括CANbus、I²C、LINbus、SPI和UART/USART,满足多样化的通信需求。
    • CANbus:适用于汽车电子和工业控制中的高可靠性通信。
    • I²C和SPI:用于连接传感器、存储器和其他外设。
    • UART/USART:支持串行通信,适用于调试和数据传输。
  4. 外设功能

    • 低电压检测(LVD):监控电源电压,确保系统在电压异常时安全运行。
    • 上电复位(POR):提供可靠的启动机制。
    • 脉宽调制(PWM):支持电机控制、LED调光等应用。
    • 看门狗定时器(WDT):提高系统可靠性,防止程序跑飞。
  5. 模拟功能

    • 内置16通道12位模数转换器(ADC),支持高精度模拟信号采集,适用于传感器接口和信号处理。
  6. 电源管理

    • 宽电压供电范围:2.7V ~ 5.5V,适应多种电源环境。
    • 低功耗设计:适合电池供电或对功耗要求严格的应用。
  7. 工作环境

    • 工作温度范围:-40°C ~ 125°C,满足工业和汽车电子等严苛环境的要求。
  8. 封装与安装

    • 封装类型:64引脚LQFP(10mm x 10mm),表面贴装型,便于PCB设计和生产。

应用领域
S9KEAZ64AMLH 凭借其高性能和丰富的功能,广泛应用于以下领域:

  1. 工业控制:用于PLC、电机控制、传感器接口等。
  2. 汽车电子:适用于车身控制、车载通信和电源管理等。
  3. 消费电子:用于智能家居、可穿戴设备和便携式设备。
  4. 物联网(IoT):支持低功耗通信和数据处理,适用于智能传感器和边缘计算设备。

开发支持
恩智浦为S9KEAZ64AMLH提供了完善的开发工具和资源,包括:

  • 集成开发环境(IDE):如MCUXpresso IDE,支持代码编写、调试和仿真。
  • 软件开发套件(SDK):提供丰富的驱动库和示例代码,加速开发进程。
  • 硬件开发板:如评估板和开发套件,便于原型设计和功能验证。

总结
S9KEAZ64AMLH 是一款功能强大、灵活多样的32位单片机,适用于多种嵌入式应用场景。其基于ARM Cortex-M0+内核的设计,结合丰富的连接能力和外设资源,能够满足复杂系统的需求。同时,其低功耗特性和宽温度范围,使其在工业和汽车电子等领域表现出色。无论是初学者还是经验丰富的开发者,S9KEAZ64AMLH 都能提供高效、可靠的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.