Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PCF2123BS/1,518 PCF2123BS
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP PCF2123BS / 1, 518
- Type
- NXP
- Minimum package
- 6000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- PCF2123BS/1,518
- Electronic Component
- 1
- Package
- HVQFN-16(3x3)
- Electronic Component
- Real-Time Clock (RTC)
- Electronic Component
- 0.2g
- Electronic Component
- 1
- Features
- Gate;; Output
- Electronic Component
- BM0257165776
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.6V~5.5V
- Interface Type
- SPI
- Crystal Oscillator Type
- Electronic Component
- Output
- Electronic Component
- Static Current(Iq)
- 100nA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PCF2123BS/1,518 产品概述
一、产品简介
PCF2123BS/1,518 是恩智浦（NXP）的一款低功耗实时时钟（RTC）芯片，集成时钟与日历功能，采用外置晶振工作并提供闹钟输出。器件适用于对功耗和尺寸有严格要求的电池供电设备与工业控制系统，能够在宽电压和宽温度范围内稳定计时。
二、主要特性
- 接口类型：SPI 串行外设接口，支持标准 SPI 时序，便于与微控制器连接。
- 工作电压：1.6V ~ 5.5V，兼容多种电源架构与电池类型。
- 晶振：外置晶体振荡器（通常配合 32.768 kHz 低频晶体），提供精确时间基准。
- 闹钟输出：带独立闹钟/中断引脚，可用于唤醒主控或触发定时事件。
- 工作温度：-40℃ ~ +85℃，满足工业级温度要求。
- 静态电流(Iq)：典型值 100 nA，适合超低功耗应用与长期电池备份。
- 封装：HVQFN-16 (3x3)，带裸露焊盘（exposed pad），利于散热与接地。
三、封装与引脚注意
HVQFN-16 小尺寸封装便于空间受限的设计，裸露焊盘建议焊接至接地平面以提高热性能与 EMC 表现。布局时应为外置晶体与电容预留合适走线并靠近芯片的晶振引脚，以降低寄生影响。
四、典型应用
- 可穿戴设备与便携式终端
- 物联网节点与传感器网关
- 智能电表与抄表设备
- 工业控制与数据记录器
- 家电与消费电子需定时唤醒的场景
五、使用建议与注意事项
- 选用与芯片匹配的低频晶体（常见为 32.768 kHz），并按照厂商应用说明选择负载电容。
- 为保证最低静态电流，注意供电与备份电池的隔离设计，避免不必要的拉高或外部干扰。
- SPI 时序与电平需与主控匹配，必要时使用电平转换器以保障不同供电域的兼容性。
- 参考数据手册进行 PCB 布局，关键为晶体走线短且远离高频干扰源，裸露焊盘良好接地。
六、优势亮点
低至 100 nA 的静态电流、宽电压范围与工业级温度能力，使得 PCF2123BS/1,518 在对续航和可靠性有高要求的产品中具有明显优势；SPI 接口在多种微控制器平台上易于集成，HVQFN 小封装利于产品小型化设计。
七、总结
PCF2123BS/1,518 是一颗面向低功耗与高可靠性场景的 RTC 芯片，凭借宽电压、外置晶振、闹钟输出以及工业温度范围，适合用于各类需要精确时钟与低功耗待机的终端产品。使用时应遵循晶体选型与 PCB 布局建议，以获得最佳时钟精度与最低功耗表现。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
