WMSIC Electronic Components

PCAL6408APWJ

ModelPCAL6408APWJ
Package16-TSSOP
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP PCAL6408APWJ
Type
NXP
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCAL6408APWJ
Electronic Component
1
Package
16-TSSOP
Electronic Component
I / O Expander
Electronic Component
0.16g
Electronic Component
1
I / O
8
Features
Built-in LEDDriver; positions; and; IOLevel
Electronic Component
BM0258714288
Operating Temperature
40℃~+85℃
Operating Voltage
1.65V~5.5V
Interface Type
I2C;SMBus
Current(IOL)
25mA
Clock Frequency(fc)
400kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCAL6408APWJ 产品概述

PCAL6408APWJ 是恩智浦(NXP)推出的一款高性能 8 位 I/O 扩展器,支持 I²C 与 SMBus 接口(最高 400 kHz),专为在有限 MCU 引脚下扩展数字 I/O、驱动指示灯与按键扫描等应用而设计。器件工作电压宽,工作温度范围宽广,封装为 16‑TSSOP,适合消费、工业与便携类电子产品。

一、主要特性

  • 接口:I²C / SMBus,最大时钟 400 kHz。
  • I/O 数量:8 路双向通用 I/O,电平可配置。
  • 输出类型:支持推挽与开漏输出配置,灵活适配不同负载与总线拓扑。
  • 灌电流(IOL):单端口可支持高达 25 mA,适合直接驱动小功率 LED 或指示灯。
  • 中断:具中断输出,用于事件驱动的快速响应与主控 CPU 唤醒。
  • 地址扩展/级联:支持硬件地址配置,便于系统扩展(器件支持级联,最多 2 个同址设备并联)。
  • 低功耗:静态电流典型值约 1 µA,适用于电池供电系统。
  • 电源与温度:工作电压范围 1.65 V ~ 5.5 V,工作温度 -40 ℃ ~ +85 ℃。
  • 封装:16‑引脚 TSSOP(PWJ 封装)。

二、功能概述

PCAL6408APWJ 提供寄存器级控制(通过 I²C 读写)以配置每路 I/O 的方向(输入/输出)、输出类型(推挽/开漏)、极性翻转、以及启用内部 LED 驱动功能。中断引脚在输入状态变化或指定事件发生时触发,支持主控中断聚合与快速响应,节省系统功耗。复位功能确保上电与异常时器件回到已知状态,便于系统可靠启动。

三、电气与性能要点

  • I²C 时钟频率:最高 400 kHz(兼容 SMBus)。
  • 驱动能力:单路输出灌电流可达 25 mA(请按功耗及封装热限值设计)。
  • 低功耗特性:静态电流约 1 µA,在休眠或低活动状态下有利于延长电池寿命。
  • 电平兼容:1.65 V 至 5.5 V 宽电压工作范围,适配 1.8 V、3.3 V 与 5 V 系统。
    使用时需注意 I/O 在不同电源电压下的容限与驱动能力,以及总线上的上拉电阻值对通信可靠性的影响。

四、典型应用场景

  • 按键矩阵与触控按键扫描(带中断唤醒功能)。
  • LED 指示与状态显示(内置 LED 驱动,支持单独控制)。
  • 人机界面扩展(按钮、开关、指示灯)。
  • 工业控制与传感器信号扩展。
  • 便携设备 I/O 扩展,节省 MCU 引脚资源。

五、封装与选型提示

PCAL6408APWJ 提供 16‑TSSOP 封装,便于 PCB 密度要求较高的设计。选型与设计时建议注意如下事项:

  • LED 驱动与高电流输出时,核算功耗与 PCB 散热;必要时外接限流电阻或驱动晶体管。
  • 确保 I²C 总线上的上拉电阻与时序匹配 400 kHz 通信;多个器件并联时,地址线配置准确以避免冲突。
  • 使用复位与中断功能配合系统电源管理以实现快速唤醒与低功耗运行。
  • 加强去耦:在 VCC 旁放置合适的旁路电容以保证通信与稳定性。

PCAL6408APWJ 为需要可靠、低功耗且灵活可配置的 I/O 扩展方案提供了丰富的功能集与宽电源兼容性,是扩展外设控制与实现简单 LED/按键管理的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.