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MKL16Z128VFM4R
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP MKL16Z128VFM4R
- Type
- NXP
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- MKL16Z128VFM4R
- Electronic Component
- 1
- Package
- 32-QFN（5x5）
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 1g
- CPU
- 32 Bit
- CPU
- ARM Cortex-M0+
- I / O
- 28
- RAM
- 16KB
- Electronic Component
- 1
- Features
- (BOR / LVD / LVR / LVI);; positions(POR); Gate positions; Built-in General Purpose
- Electronic Component
- BM0253874768
- Operating Temperature
- 40℃~+105℃
- Operating Voltage
- 1.71V~3.6V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MKL16Z128VFM4R 产品概述
一、产品简介
MKL16Z128VFM4R 是恩智浦（NXP）Kinetis L 系列基于 ARM Cortex‑M0+ 内核的 32 位微控制器。器件主频最高可达 48MHz，集成 128KB（128K x 8）Flash 程序存储与 16KB SRAM，面向低功耗、成本敏感的嵌入式控制与传感器节点应用。
二、主要规格
- CPU 内核：ARM Cortex‑M0+（32‑bit），最高 48MHz
- 程序存储：128KB Flash（128K x 8）
- 数据存储：16KB SRAM
- I/O 数量：28 个可用 I/O 引脚
- 振荡器：内置振荡器（片内时钟源）
- 工作电压：1.71V ～ 3.6V
- 工作温度：-40℃ ～ +105℃
- 封装：32‑引脚 QFN（5×5 mm）
三、关键特性与优势
- 低功耗架构：Cortex‑M0+ 内核配合 Kinetis 平台的省电模式，适合电池供电设备与节能型终端。
- 充足的存储资源：128KB Flash + 16KB RAM，能满足多数中小型控制固件与通信协议栈。
- 宽电压工作范围：1.71V–3.6V 支持单节锂电、2‑三级电源方案及 3.3V 系统兼容性。
- 商用至工业温度等级：-40℃ 到 +105℃，适用于工业级环境。
四、封装与硬件注意事项
- QFN32（5×5 mm）封装提供紧凑 PCB 占板面积，但需注意散热与焊盘设计，保证可靠焊接与热扩散。
- 内置振荡器便于快速上电测试与低成本方案，但对精确时钟需求（例如 USB、精确通信）时需考虑外部晶振或校准方案。
- 28 个 I/O 适合驱动传感器、按键、指示灯与串行外设；复杂外设扩展需规划多路复用与电平匹配。
五、典型应用场景
- 低功耗物联网终端、无线传感节点（需配合外部无线模块）
- 工业控制与数据采集模块
- 智能家居控制器、门锁、仪表与便携设备
- 入门级嵌入式产品与教学开发板
六、开发与生态建议
- 常用调试接口：建议使用 SWD 接口进行在线调试与编程。
- 外设兼容：Kinetis 生态下有丰富的软件库、驱动与示例，可加速开发周期。
- 电源与 EMC：供电滤波、去耦与稳压器选择直接影响 ADC 等模拟性能，布线时注意地线回路与敏感信号隔离。
总结：MKL16Z128VFM4R 在小尺寸封装下提供可观的 Flash/RAM 资源和 48MHz 性能，适合对成本、功耗与工业温度有要求的嵌入式控制与传感应用。根据项目需求合理选配外部晶振、供电与外设，可以实现稳定且高效的系统设计。
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