Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TJA1022TK,118 TJA1022TK
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP TJA1022TK, 118
- Type
- NXP
- Minimum package
- 6000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- TJA1022TK,118
- Electronic Component
- 1
- Package
- 14-HVSON（3x4.5）
- Type
- Transceiver
- Electronic Component
- LIN Transceiver
- Electronic Component
- 0.36g
- Electronic Component
- 1
- Features
- Bus;;; TXD; Bus; Low Power
- Electronic Component
- BM0262715410
- Operating Temperature
- 40℃~+150℃
- Operating Voltage
- 5V~18V
- Receiver
- 2
- Static Current
- 10uA
- Electronic Component
- ±8kV
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TJA1022TK,118 产品概述
一、产品简介
TJA1022TK,118 为恩智浦（NXP）推出的双路 LIN 总线收发器，面向汽车电子网络的物理层连接。器件支持 2 个驱动器与 2 个接收器，可在单芯片上实现双通道 LIN 通信，适用于车身控制、座椅、门锁、传感器与执行器等分布式模块。
二、主要特性
- 类型：收发器（双通道，2 驱动 / 2 接收）
- 工作电压：5 V ～ 18 V，适应汽车电源波动与瞬态
- 工作温度：-40 ℃ ～ +150 ℃，满足严苛环境要求
- 静态电流：10 μA（典型待机功耗，支持低功耗睡眠）
- 静电保护：±8 kV（IEC 相关 ESD 保护等级）
- 总线协议：LIN 物理层兼容，支持主/从节点拓扑
- 封装：14-HVSON（3 × 4.5 mm），体积小、散热性能良好
三、封装与机械优势
14-HVSON（3×4.5）小型高压 SON 封装，有利于空间受限的车载模块设计。紧凑封装同时提供可靠的热路径，适合高温工作条件与长期耐用需求。
四、典型应用场景
- 车身电子与车门控制单元（BCM）
- 座椅调节与记忆模块
- 车内传感器与执行器网络
- 低速车载局域网桥接与扩展模块
五、设计注意事项与可靠性
- 总线端需合适终端电阻与滤波，保证信号完整性与抗噪能力。
- 推荐电源旁路与瞬态抑制器件以对抗电源跃变与负载开关。
- 在高温工况下注意热设计与 PCB 散热布局，HVSON 引脚焊盘设计影响热阻。
- 系统级需考虑 LIN 协议栈与故障安全机制（总线短路、仲裁与唤醒管理）。
总结：TJA1022TK,118 提供紧凑封装下的双通道 LIN 收发能力，低待机电流与宽电压/温度范围使其成为车载分布式控制系统中可靠的物理层器件选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
