WMSIC Electronic Components

PCF7936AA/3851/C/6 PCF7936AA

ModelPCF7936AA/3851/C/6
PackageTSSOP-20
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP PCF7936AA / 3851 / C / 6
Type
NXP
Unit
Electronic Component
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ISO 15693;ISO 14443
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
PCF7936AA/3851/C/6
Electronic Component
1
Package
TSSOP-20
Electronic Component
RF Card IC
Electronic Component
0.58g
Electronic Component
1
Electronic Component
BM0258754774
Operating Voltage
5.6V~27V
Interface Type
SPI
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PCF7936AA/3851/C/6 产品概述

一、产品简介

PCF7936AA/3851/C/6 是恩智浦(NXP)面向低频射频识别(RFID)读写应用的芯片解决方案,封装为 TSSOP-20。器件支持常见的 RFID 协议并以 SPI 总线作为主控接口,工作电压范围宽(5.6V~27V),适合汽车、安防与工业类应用中对宽输入电源与稳定低频读写要求的场景。本器件针对 125 kHz 载波进行了电路优化,集成相位锁定环(PLL)等关键模块以保证载波稳定与读写性能。

二、主要特性

  • 支持协议:ISO 15693、ISO 14443(与高频卡或兼容设备的互操作能力);同时优化 125 kHz 标签(读/写)工作。
  • 射频特性:125 kHz 工作频点,内置频率稳定化模块(PLL),适配常见低频标签线圈与匹配网络。
  • 接口与封装:SPI 外设接口,标准 TSSOP-20 封装,便于与主控 MCU 或 FPGA 连接和 PCB 布局。
  • 供电与可靠性:工作电压范围 5.6V~27V,适合直接与车载或工业电源相连,具备较强的电源兼容性。

三、电气参数与接口说明

  • 电源:宽电压输入,可在 5.6V~27V 范围内稳定工作;建议在电源入口加入合适的滤波与瞬态抑制元件以提升稳定性。
  • SPI 接口:典型信号包括 SCLK、MOSI、MISO、CS(具体命名与时序请参照芯片数据手册);主控侧需提供符合逻辑电平要求的驱动,必要时采用电平移位器。
  • 射频引脚:外接线圈/天线驱动与检测引脚,需配合匹配电路(电容、谐振网络)实现最佳耦合与读写距离。

四、典型应用场景

  • 汽车钥匙与被动进入系统(PKE)中的低频标签读写与识别。
  • 工业设备身份识别、物料跟踪与资产管理。
  • 门禁与考勤系统中对 125 kHz 标签的读写需求。
  • 与 ISO 14443/15693 兼容的复合读写器设计(多协议支持的读写终端)。

五、集成与设计建议

  • 天线与匹配:125 kHz 线圈设计应考虑线圈匝数、感值与谐振电容,采用可调匹配以优化不同环境下的读写距离。
  • 电源与去耦:在芯片电源端布局大值旁路电容与高速陶瓷电容,靠近器件放置,建议加 TVS 保护以应对突发过压。
  • PCB 布局:TSSOP-20 引脚周边保持良好接地平面,射频路径尽量短并避免与高噪声信号线并行。
  • 软件与协议:通过 SPI 访问内部命令与寄存器,推荐参考官方固件/数据手册实现稳定的读写流程与错误处理机制。

六、注意事项与合规

  • 为确保性能与兼容性,最终设计前务必查阅并遵循 PCF7936AA 系列的完整数据手册与应用笔记。
  • 在高电压环境下(接近上限 27V)工作时,需验证器件温升、可靠性与系统 EMC,必要时做保护电路与隔离设计。
  • 产品在不同国家/地区的射频发射要求与认证(如 FCC、CE 等)需在量产前完成合规性测试与认证。

如需更详细的时序、寄存器定义、典型应用电路或参考设计,请根据型号索取并研读恩智浦官方数据手册与应用说明,以确保设计性能与法规合规。

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