WMSIC Electronic Components

LPC2146FBD64

ModelLPC2146FBD64
PackageLQFP-64(10x10)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP LPC2146FBD64
Type
NXP
Minimum package
160 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
LPC2146FBD64
Electronic Component
1
Package
LQFP-64(10x10)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
2.861g
CPU
16/32 Bit
I / O
45
RAM
40KB
Electronic Component
1
ADC
10bit
DAC
10bit
Features
(BOR / LVD / LVR / LVI);; positions(POR); Gate positions; Built-in General Purpose
Electronic Component
BM0265744131
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

恩智浦LPC2146FBD64微控制器产品概述

恩智浦LPC2146FBD64是一款基于ARM7TDMI-S内核的32位微控制器,专为工业控制、消费电子等中低端嵌入式场景设计,具备高集成度、稳定可靠的特点,以下是详细概述。

一、核心架构与运算性能

该芯片采用ARM7TDMI-S改进型内核,支持16位Thumb指令集与32位ARM指令集灵活切换:Thumb模式可降低代码密度(约节省30%存储),ARM模式则提供更高运算速度,兼顾设计灵活性与性能需求。最大主频可达60MHz,单周期执行多数指令,能满足实时控制、数据处理等场景的响应要求,适合对运算效率有一定需求的嵌入式系统。

二、存储资源配置

LPC2146FBD64集成两类核心存储:

  • 程序存储:256KB高速FLASH(256kx8bit),支持在线编程(ISP)与在应用编程(IAP),无需拆卸芯片即可实现固件升级,便于现场维护;
  • 数据存储:40KB SRAM,作为程序运行时的变量、堆栈及临时数据缓存,无需额外扩展外部存储,简化硬件设计与成本。

三、外设功能与接口资源

1. 数字/模拟接口

  • 提供45个通用I/O引脚,支持上拉/下拉、开漏等多种模式,适配各类外部设备(如按键、LED、继电器);
  • 集成10位ADC(模数转换器)与10位DAC(数模转换器),可实现模拟信号采集(如传感器数据)与输出(如简单模拟控制),无需额外外接ADC/DAC芯片。

2. 通信与定时外设

  • 内置UART(通用异步收发器)、SPI(串行外设接口)、I2C(内部集成电路)等通信接口,支持与传感器、存储芯片、蓝牙/WiFi模块等外设的高速数据交互;
  • 配备通用定时器、PWM(脉冲宽度调制)模块,可实现定时控制、电机驱动(如小型直流电机调速)、脉冲计数等功能。

3. 时钟与电源管理

采用内置振荡器,无需外部晶振即可稳定工作,减少BOM成本与PCB空间;支持空闲、掉电等低功耗模式,可根据系统需求切换,降低待机功耗。

四、电源与工作环境参数

  • 工作电压:3.0V~3.6V,兼容常见3.3V电源系统,无需电压转换电路;
  • 工作温度:-40℃~+85℃,符合工业级温度要求,可在户外设备、工业现场等 harsh 环境中稳定运行,可靠性较高。

五、封装与典型应用场景

LPC2146FBD64采用LQFP64封装(64引脚薄型四方扁平封装),引脚间距0.5mm,体积紧凑,便于PCB布局;其综合性能与成本优势使其适用于:

  • 工业控制:小型PLC、传感器节点、电机驱动;
  • 消费电子:智能家居设备(如智能开关)、小型家电控制;
  • 汽车电子:车载辅助系统(如胎压监测、灯光控制);
  • 物联网:边缘计算节点、数据采集终端。

总结

恩智浦LPC2146FBD64凭借ARM7内核的高性能、丰富的存储与外设资源、宽温宽压特性,成为中低端嵌入式系统的可靠选择,适合对成本敏感且需要稳定运算与外设扩展的应用场景。

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