WMSIC Electronic Components

LPC55S69JEV98K

ModelLPC55S69JEV98K
PackageVFBGA-98
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP LPC55S69JEV98K
Type
NXP
Unit
Electronic Component
Minimum package
1300 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
LPC55S69JEV98K
Electronic Component
1
Package
VFBGA-98
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.06g
CPU
32 Bit
CPU
ARM Cortex-M33
I / O
64
RAM
320KB
Electronic Component
1
ADC
16bit
Features
Gate (WWDG);; (BOR / LVD / LVR / LVI);; positions(POR); Generator (TRNG); Built-in General Purpose; Built-in Temperature Sensor; CRC
Electronic Component
BM0265968518

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LPC55S69JEV98K 32位微控制器产品概述

LPC55S69JEV98K是恩智浦(NXP)推出的高性能32位微控制器(MCU),基于ARM Cortex-M33内核架构设计,兼具高运算性能、安全特性与环境适应性,适用于工业控制、智能传感、物联网终端等多领域应用。

一、核心性能与安全架构

本产品搭载ARM Cortex-M33内核,最大主频可达150MHz,支持32位运算,为实时任务处理提供充足算力。内核集成TrustZone安全架构,可实现硬件级的安全隔离——将敏感数据(如加密密钥、用户隐私)与普通应用代码分离存储,有效抵御恶意攻击,满足工业数据加密、消费电子身份验证等对安全要求较高的场景。同时,内置振荡器简化了外部电路设计,无需额外配置外部晶振即可稳定工作。

二、存储与外设资源

2.1 存储容量

程序存储采用640KB FLASH,支持程序代码、配置参数的非易失性存储,可满足中等复杂度应用的代码容量需求;内置320KB RAM,可支撑实时数据缓存、中断处理等动态数据操作,无需额外扩展外部存储,降低系统成本与布局复杂度。

2.2 外设接口

  • 通用I/O口:共64个,支持推挽、开漏等多种驱动模式,且具备中断触发功能,可灵活连接传感器、执行器、通信模块等外设;
  • 模拟接口:集成16位ADC,采样精度高,适合温度、压力、电流等模拟信号的高精度采集(如工业传感器节点的信号转换);
  • 常规通信外设:支持多组UART、SPI、I2C串行接口,可实现与蓝牙模块、显示屏、存储芯片等外设的高速数据传输。

三、封装与工作环境

3.1 封装规格

采用98-VFBGA封装,尺寸为7mm×7mm,小体积设计适合紧凑型产品(如穿戴设备、小型工业节点),节省PCB布局空间,便于集成到空间受限的终端中。

3.2 工作环境

  • 工作电压:1.8V~3.6V宽电压范围,适配电池供电(如2节AA电池)、工业12V/24V电源等不同供电系统,灵活性强;
  • 工作温度:-40℃~+105℃工业级温度范围,可稳定工作于户外、车间等恶劣环境(如夏季高温车间、冬季户外监测站),无需额外散热或保温措施。

四、典型应用场景

  1. 工业控制领域:宽温范围与安全架构适合电机控制、PLC模块、过程监测系统,可稳定应对工业现场的温度波动与电磁干扰;
  2. 智能传感节点:16位ADC高精度采样+小封装,适用于环境监测(温湿度、气体传感器)、工业物联网(IIoT)终端节点;
  3. 消费电子:低功耗特性(Cortex-M33原生支持)与小体积,适合智能穿戴、智能家居控制器(如智能开关、传感器网关);
  4. 物联网终端:TrustZone安全架构保障数据传输安全,适合远程监控、智能门锁等需要加密的物联网场景。

五、产品核心优势

  1. 安全可靠:Cortex-M33 TrustZone实现硬件级安全隔离,提升数据防篡改能力,降低被攻击风险;
  2. 性能均衡:150MHz主频+640KB FLASH/320KB RAM,满足中等复杂度应用的实时处理需求,无需频繁优化代码;
  3. 环境适应性强:宽温宽压+工业级封装,覆盖从消费电子到工业场景的多类应用;
  4. 设计简化:内置振荡器减少外部元件数量,小封装降低PCB成本与空间占用,缩短产品开发周期。

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