WMSIC Electronic Components

LPC11U68JBD100K

ModelLPC11U68JBD100K
PackageLQFP-100(14x14)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP LPC11U68JBD100K
Type
NXP
Unit
Electronic Component
Minimum package
90 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
LPC11U68JBD100K
Electronic Component
1
Package
LQFP-100(14x14)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
14.24g
CPU
32 Bit
CPU
ARM Cortex-M0+
I / O
80
RAM
36KB
Electronic Component
1
ADC
12bit
EEPROM
4KB
Electronic Component
BM0265968519

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LPC11U68JBD100K 单片机产品概述

LPC11U68JBD100K是恩智浦(NXP)推出的一款32位低功耗单片机,基于ARM Cortex-M0+内核设计,具备高集成度、宽工作范围等特点,适用于工业控制、智能传感等多种场景。以下从核心架构、存储资源、接口能力等维度展开概述:

一、核心架构与性能参数

该芯片采用ARM Cortex-M0+内核,是针对低功耗、低成本场景优化的32位处理器,代码密度高且功耗低,适合电池供电或对能耗敏感的应用。其最大主频可达50MHz,能够满足一般控制任务的实时性需求(如数据采集、通信协议处理、简单逻辑运算等)。

时钟系统内置振荡器,无需外接晶振即可稳定工作,既简化了电路设计,又降低了BOM成本;若需更高精度时钟,也可外接外部晶振扩展,兼顾灵活性与实用性。

二、存储资源配置

LPC11U68JBD100K的存储资源分为三类,满足不同数据存储需求:

  • 程序存储:256KB FLASH,可存储应用程序、常量数据及固件,容量足够支撑中等复杂度的控制程序(如带多协议通信的工业控制器);
  • 运行存储:36KB RAM,用于存储变量、堆栈及临时数据,支持程序高效运行;
  • 非易失数据存储:4KB EEPROM,专门用于存储掉电不丢失的关键数据(如设备校准参数、用户设置、唯一ID等),无需额外外接EEPROM芯片,进一步简化系统设计。

三、接口与I/O资源

芯片提供80个通用I/O引脚,引脚数量充足,可满足多外设扩展需求(如连接按键、LED、继电器、传感器等)。同时集成12位ADC,分辨率达1/4096,适合采集模拟信号(如温度、压力、湿度传感器的输出),精度满足大多数工业/消费类场景的要求。

此外,作为NXP LPC11U系列产品,该芯片还集成了常用数字接口(如UART、SPI、I2C等),支持与其他外设(如蓝牙模块、显示屏、存储芯片)通信,扩展系统功能。

四、工作环境与封装规格

1. 工作环境参数

  • 工作电压:2.4V~3.6V,宽电压范围适配多种电源方案(如3V纽扣电池、5V转3.3V电源模块),电源设计灵活;
  • 工作温度:-40℃~+105℃,工业级温度范围,可稳定工作于户外、车间等 harsh 环境,适合工业控制、车载辅助设备等场景。

2. 封装规格

采用100-LQFP(14×14mm) 封装,引脚间距通常为0.5mm,PCB布局难度低,回流焊工艺易实现,适合中小批量及量产生产;封装尺寸紧凑,可降低终端产品的体积。

五、典型应用场景

结合其性能与参数特点,LPC11U68JBD100K适用于以下场景:

  1. 工业控制:如小型PLC、电机控制、温度/压力监测模块;
  2. 智能传感节点:如环境监测传感器、工业传感器(需掉电数据存储);
  3. 消费电子:如手持设备、小型家电(如智能加湿器、温控器);
  4. 车载辅助设备:如车载USB控制器、温度监测模块(工业级温度适配)。

该芯片以高集成度、低功耗、宽工作范围为核心优势,在简化系统设计的同时,兼顾了性能与可靠性,是工业、消费电子等领域的高性价比选择。

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