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MC33926PNB
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP MC33926PNB
- Type
- NXP
- Minimum package
- 1300 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- MC33926PNB
- Electronic Component
- 1
- Package
- PQFN-32(8x8)
- Electronic Component
- Brushed DC Motor Driver IC
- Electronic Component
- 0.001g
- Electronic Component
- 1
- Integrated FET
- Electronic Component
- H
- 1
- Features
- Switch; Current Sampling
- Electronic Component
- BM0259723340
- Resistor
- 225mΩ
- Current
- 5A
- Operating Temperature
- 40℃~+125℃
- Static Current(Iq)
- 50uA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MC33926PNB 产品概述
一、核心规格
MC33926PNB 为 NXP（恩智浦）推出的单通道 H 桥电机驱动器，核心参数如下：
- 集成 FET：是（片内功率 MOSFET 已集成）
- H 桥数量：1（单路双向驱动）
- 峰值电流：5 A（短时峰值）
- 导通电阻（RDS(on)）：225 mΩ
- 静态电流（Iq）：50 μA（低待机功耗）
- 工作温度范围：-40 ℃ ～ +125 ℃（适合汽车级应用）
- 封装：32 引脚 PQFN（8 mm × 8 mm）
二、主要特点与优势
- 集成化程度高：内置功率 FET 简化外围设计，减少 PCB 面积与器件数量。
- 低静态电流：50 μA 的静态耗电利于电池供电系统的待机续航。
- 宽温度等级：-40～+125 ℃ 适用于工业与车规环境。
- PQFN-32（8×8）封装利于热量通过底部散热垫传导到 PCB，提高散热性能。
- 并联能力：产品描述提及“并联”，在需要更大驱动电流时可考虑并联方案，但并联需遵循严格的布局与匹配规则以保证电流均分。
三、性能评价（热损耗示例）
导通损耗随电流平方增长，按 RDS(on)=0.225 Ω 计算：
- 峰值 5 A（短脉冲）时，瞬时导通损耗约 P = I^2·R = 25·0.225 ≈ 5.6 W（短脉冲可接受，持续则需散热措施）。
- 若连续工作电流为 2 A，则 P ≈ 0.9 W，较易通过良好 PCB 导热管理散出。
因此在选型时应以连续 RMS 电流和占空比为依据进行热设计与器件散热评估。
四、典型应用场景
- 小型直流电机驱动：玩具、机器人、舵机、风扇控制等。
- 汽车车身附件：门锁、座椅调节、后视镜等低功率电机场合（注意车规定级认证要求）。
- 工业自动化：小型执行器、泵和阀的驱动控制。
五、布局与使用建议
- 热管理：在 PCB 下方留足焊盘并布置多颗热通孔（thermal vias），将热量传导至大面积铜箔或底层散热区。
- 去耦与滤波：靠近 VCC 与 GND 放置低 ESR 电容（如陶瓷电容）以抑制开关瞬态。
- PWM 驱动：使用微控制器 PWM 控制 H 桥门级，关注开关边沿与死区时间，降低反向冲击。
- 并联注意：并联器件时需保证每通道的电气与热分布一致，推荐参考器件应用笔记与实验验证电流均分性能。
- 校核保护：在设计时核对数据手册中关于过流、欠压、过温等保护机制，并为连续高负载工况做适当降额。
结束语：MC33926PNB 以其集成化 FET、低静态电流和车规温度能力，适合对空间、功耗与环境适应性有要求的小功率电机驱动方案。最终应用前建议仔细阅读 NXP 官方数据手册与参考设计，并在目标系统上完成热特性与动态性能验证。
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