WMSIC Electronic Components

MC34VR500V4ES

ModelMC34VR500V4ES
PackageTQFN-56-EP(8x8)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NXP MC34VR500V4ES
Type
NXP
Minimum package
260 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
MC34VR500V4ES
Electronic Component
1
Package
TQFN-56-EP(8x8)
Electronic Component
DC-DC Power Supply IC
Electronic Component
2.015g
Electronic Component
1
Features
Dynamic Voltage
Type
Electronic Component
Electronic Component
BM0265584618
Operating Temperature
40℃~+105℃@(TA)
Operating Voltage
2.8V~4.5V
Switching Frequency
1MHz~4MHz
Electronic Component
Electronic Component
Output Voltage
625mV~1.875V;-;625mV~3.3V;625mV~3.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MC34VR500V4ES 降压型PMIC产品概述

一、产品定位与核心应用

MC34VR500V4ES是恩智浦(NXP)推出的多通道降压型电源管理IC(PMIC),专为QorlQ-LS1-T1系列通信处理器量身打造,聚焦解决通信设备中多电源域紧凑化供电的核心需求。该产品通过高度集成化设计,为通信处理器及周边外设提供稳定、高效的供电方案,广泛适配车载通信、工业通信、边缘计算等对可靠性、集成度要求严苛的场景。

二、关键性能参数详解

1. 供电范围与输出能力

  • 输入电压:覆盖2.8V~4.5V宽范围,兼容常见的3.3V、4V等电源输入,适配车载蓄电池、工业电源等不同供电来源;
  • 输出通道:4路独立降压(Buck)输出,满足通信处理器多核心(CPU、GPU)、内存(DDR)、高速接口(以太网、CAN)等多电源域的供电需求,无需额外扩展多颗PMIC;
  • 内置开关管:所有降压通道均集成同步功率开关管,无需外接功率MOSFET,显著减少外部元件数量,降低BOM成本与PCB布局复杂度。

2. 开关频率与效率优化

  • 开关频率:支持1MHz~4MHz可调/固定频率,高频率设计可大幅缩小电感、电容等被动元件的体积,适配小封装PCB需求;
  • 同步整流架构:内置同步整流器替代续流二极管,降低导通损耗,在轻载至满载范围内保持高效能(典型效率可达90%以上)。

3. 环境适应性

  • 工作温度:支持-40℃~+105℃(环境温度TA)宽温范围,符合车载(AEC-Q100标准兼容)、工业级应用的极端环境要求,可稳定工作于高温、低温及温度波动场景;
  • 保护机制:集成欠压锁定(UVLO)、过流保护(OCP)、过压保护(OVP)、过温保护(OTP)等多重保护,防止异常工况下损坏负载与自身,提升系统稳定性。

三、拓扑结构与集成特性

MC34VR500V4ES采用降压式(Buck)拓扑,4路输出均为同步Buck转换器,具备以下核心特性:

  • 内置补偿电路:无需外接RC补偿网络,简化设计流程,缩短产品开发周期;
  • 时序控制:支持输出电压软启动与时序配置,匹配QorlQ-LS1-T1通信处理器的上电/下电时序要求,避免电源波动对处理器的冲击;
  • 低噪声设计:优化开关噪声抑制,减少对通信信号的干扰,满足千兆以太网等高速接口的EMI要求。

四、封装与散热设计

  • 封装类型:采用QFN-56-EP(8×8mm)封装,带暴露焊盘(EP);
  • 散热优势:暴露焊盘直接与PCB接地层连接,有效提升热传导效率,解决多通道供电时的散热问题,保障长期稳定工作;
  • 引脚布局:56引脚QFN封装兼顾引脚数量(满足4通道控制、反馈及保护功能需求)与封装尺寸,适配高密度PCB设计。

五、典型应用场景

  1. 车载通信系统:适配车载网关、T-Box(远程信息处理单元)、车联网终端等,满足QorlQ-LS1-T1处理器的供电需求,宽温与可靠性符合车载级标准;
  2. 工业通信设备:用于工业交换机、边缘计算节点、工业物联网网关,适应工业现场的宽温、振动环境;
  3. 通信处理器配套电源:作为QorlQ-LS1-T1系列专用PMIC,实现供电方案标准化,减少客户定制化设计工作量。

总结:MC34VR500V4ES通过集成化、高可靠性与宽适应性设计,为QorlQ-LS1-T1通信处理器提供高效、紧凑的供电解决方案,是车载、工业通信等领域的理想电源管理选择。

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