Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MCIMX6U5EVM10AC
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NXP MCIMX6U5EVM10AC
- Type
- NXP
- Minimum package
- 60 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- MCIMX6U5EVM10AC
- Electronic Component
- 1
- Package
- 624-MAPBGA（21x21）
- Electronic Component
- MCU(MCU / MPU / SOC)
- Electronic Component
- 1.36g
- CPU
- 32 Bit
- CPU
- ARM Cortex-A
- Electronic Component
- 1
- Electronic Component
- BM0265370543
- Operating Temperature
- 20℃~+105℃
- Operating Voltage
- 1.8V；2.8V；3.3V；2.5V
- CPU
- 1GHz
- Electronic Component
- Electronic Component
- Electronic Component
- 60
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MCIMX6U5EVM10AC 产品概述
一、核心硬件规格
MCIMX6U5EVM10AC基于恩智浦i.MX6ULL系列，采用ARM Cortex-A7单核架构，最高主频可达1GHz，平衡了算力与功耗，满足中等复杂度任务需求。内置128KB SRAM（静态随机存储器），支持快速临时数据存储与访问，轻量运算可脱离外部内存独立完成；集成丰富外设控制器，包括UART、SPI、I2C、CAN FD、USB 2.0、SDIO等，适配多类传感器、通信模块与外部设备连接。
二、封装与环境适应性
采用624引脚MAPBGA（21×21mm） 封装，紧凑尺寸适合高密度电路板布局，同时通过优化引脚排布提升散热效率。工作温度范围覆盖**-20℃至+105℃**，符合工业级环境要求，可稳定运行于户外设备、车载终端、工厂自动化系统等温差较大的场景，无需额外复杂的散热/保温设计。
三、典型应用场景
- 工业自动化：小型PLC（可编程逻辑控制器）、远程IO模块、工业传感器网关，稳定支撑现场数据采集与实时控制；
- 车载电子：T-Box（远程信息处理单元）、车载诊断工具、辅助信息娱乐控制器，满足车规级温度与可靠性要求；
- 物联网边缘节点：智能安防终端、智能家居控制中心、边缘计算网关，平衡算力与功耗，支持多设备联网与数据预处理；
- 消费电子：高性能便携式设备、智能显示终端，提供流畅的用户交互体验。
四、关键优势特点
- 低功耗能效比：Cortex-A7架构本身具备能效优势，结合恩智浦动态电压频率调节（DVFS）技术，可根据任务负载自动调整功耗，延长电池供电设备续航；
- 工业级可靠性：通过严格的工业级可靠性测试，抗电磁干扰（EMI）能力强，宽温范围适配恶劣环境；
- 丰富接口与扩展：集成CAN FD（支持高速数据传输）、LCD控制器（最高支持1080p显示）、硬件加密引擎（AES/RSA），兼顾通信、显示与安全需求；
- 软件开发友好：支持Linux、Android等主流操作系统，适配恩智浦官方开发板（如MCIMX6ULL-EVK），降低原型开发与调试门槛。
五、选型与拓展说明
MCIMX6U5EVM10AC为工业级版本，若需更高算力可升级至i.MX6UL（多核Cortex-A7）；若需降低成本，可选择商业级温度（0℃~70℃）的同系列芯片。该芯片兼容恩智浦生态的外设模块（如无线通信模块、传感器扩展板），便于快速构建定制化系统。
该产品以稳定可靠、能效均衡的特性，成为工业控制、车载与物联网领域的高性价比选型。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
