WMSIC Electronic Components

S912XET256BMAL

ModelS912XET256BMAL
PackageLQFP-112(20x20)
BrandNXP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
NXP S912XET256BMAL
Type
NXP
Unit
Electronic Component
Minimum package
300 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
NXP
Electronic Component
S912XET256BMAL
Electronic Component
1
Package
LQFP-112(20x20)
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
1.36g
CPU
16 Bit
CPU
HCS12X
I / O
91
RAM
16KB
Electronic Component
1
ADC
12bit
EEPROM
4KB
Features
(BOR / LVD / LVR / LVI); positions(POR); Gate positions; Built-in General Purpose; ECC

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S912XET256BMAL 16位微控制器产品概述

一、产品定位与核心属性

S912XET256BMAL是恩智浦(NXP)推出的16位增强型微控制器(MCU),基于HCS12X内核设计,专为工业控制、汽车电子等对可靠性、宽温适应性要求较高的场景打造。其核心定位为“工业级/汽车级宽温MCU”,兼顾高集成度与稳定运行能力,是8位MCU向32位过渡的高性价比选择。

二、核心性能参数

该MCU采用HCS12X增强型内核,相比传统HCS12内核优化了指令集架构,提升了运算效率;最大主频可达50MHz,满足实时控制类应用的响应速度需求;16位CPU架构平衡了性能与成本,适合对算力要求中等、但需稳定运行的场景。

三、存储资源配置

存储资源均衡,适配程序存储、变量运算及非易失性数据保存需求:

  • 程序存储器:256KB FLASH,支持在线编程(ISP),可存储应用程序、固件及常量数据;
  • 随机存储器(RAM):16KB,用于临时变量、堆栈及中断处理,满足实时任务的内存需求;
  • 电可擦除可编程只读存储器(EEPROM):4KB,适合保存校准参数、用户配置等断电不丢失的非易失性数据,且支持宽温环境下的可靠读写。

四、外设接口与扩展性

  • 通用I/O口:共91个,支持数字输入/输出、中断触发等功能,可灵活连接传感器、执行器等外部器件;
  • 模拟接口:集成12位分辨率ADC,具备多通道采集能力(符合HCS12X系列标准配置),可实现模拟信号的高精度转换;
  • 通信接口:系列内置CAN、SCI(UART)、SPI等通信接口,支持工业总线(如CAN)或串行通信,便于与其他设备组网(如汽车CAN总线、工业Modbus)。

五、电气与环境适应性

  • 宽电压范围:工作电压支持1.72V~5.5V,适配不同电源系统(如汽车12V降压后的5V、工业3.3V电源等);
  • 宽温工作:环境温度覆盖**-40℃~+125℃**,满足工业现场(户外设备)、汽车发动机舱等极端温度场景的稳定运行;
  • 时钟稳定性:采用外置振荡器,相比内置振荡器提供更高时钟精度,确保时序控制可靠性(如电机驱动PWM同步)。

六、封装与典型应用

  • 封装形式:112-LQFP(20×20mm),引脚间距适中,便于PCB设计与焊接,同时兼顾体积与散热;
  • 典型应用场景:
    1. 汽车电子:车身控制模块(BCM)、动力辅助系统(电动助力转向)、传感器节点;
    2. 工业控制:电机驱动(伺服/步进电机)、工业传感器采集、小型PLC;
    3. 其他:医疗设备(便携式诊断仪器)、智能家居控制终端(需宽温宽压)。

该产品凭借宽温宽压、高集成度及稳定性能,成为工业与汽车领域的实用型MCU选择。

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