Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MC34931EK
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- NXP MC34931EK
- Type
- NXP
- Minimum package
- 42 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NXP
- Electronic Component
- MC34931EK
- Electronic Component
- 1
- Package
- SOIC-32-EP-300mil
- Electronic Component
- Brushed DC Motor Driver IC
- Electronic Component
- 0.76g
- Electronic Component
- 1
- Electronic Component
- BM0265968514
- Resistor
- 235mΩ
- Current
- 8A
- Operating Temperature
- 40℃~+85℃
- Static Current(Iq)
- 18mA
- Electronic Component
- Electronic Component
- Electronic Component
- 42
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MC34931EK有刷直流电机驱动芯片产品概述
一、核心定位与功能特性
MC34931EK是恩智浦（NXP）推出的有刷直流电机专用驱动芯片，专为需要稳定电流输出、宽环境适应性的电机控制场景设计。芯片支持电机双向驱动与转速调节，可直接替代传统离散功率管方案，大幅简化系统电路设计，降低开发复杂度与成本，是工业级、消费级电机驱动的优选方案。
二、关键性能参数解析
该芯片的核心参数完全匹配多场景电机驱动需求，具体表现如下：
- 电流能力：峰值电流可达8A，持续工作电流稳定在5A，可满足中小型有刷直流电机的动力需求（如电动工具、小型伺服系统）；
- 导通电阻：典型导通电阻仅235mΩ，低电阻设计大幅减少功率损耗，降低芯片发热，避免因过热导致的性能衰减，提升系统长期稳定性；
- 电压范围：输入电压支持5V~36V宽范围，兼容12V/24V锂电池组、开关电源等多种供电方式，适配不同应用的电源场景；
- 温度适应性：工作温度覆盖-40℃~+85℃（Ta，环境温度），符合工业级宽温标准，可适应户外、车间等恶劣环境，无需额外温控措施。
三、封装设计与散热优势
MC34931EK采用SOIC-32-EP封装（32引脚小外形集成电路，带暴露散热焊盘），封装尺寸为300mil。其中暴露焊盘（EP） 是核心设计亮点：
通过将焊盘直接焊接到PCB的散热铜箔上，可显著降低热阻（相比普通SOIC封装热阻降低约50%），快速导出芯片工作时产生的热量，避免因过热导致的故障，尤其适合大电流持续工作场景（如电动工具连续作业）。
四、品牌可靠性与适用场景
作为恩智浦旗下产品，MC34931EK继承了NXP的高可靠性设计标准，其宽温范围、低损耗特性及稳定的电流输出，使其广泛应用于以下领域：
- 工业自动化：小型传送带、分拣设备、小型伺服电机的驱动；
- 消费电子：扫地机器人、电动牙刷、手持电动工具（如电钻）的动力控制；
- 汽车电子：辅助系统（如电动座椅调节、后视镜折叠、天窗驱动）的电机控制；
- 办公设备：打印机、复印机的走纸电机与扫描电机驱动。
五、系统集成优势
该芯片无需额外配置离散功率管或复杂散热组件（仅需PCB基础散热铜箔），可直接集成到电机控制系统中，简化电路布局；同时，5V~36V的宽电压输入，减少了电源适配成本，提升了系统兼容性，适合快速量产与低成本设计需求。
综上，MC34931EK凭借宽电压、高电流、低损耗及工业级可靠性，成为多场景有刷直流电机驱动的高效解决方案，可有效提升系统性能与稳定性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
